公开(公告)号：US08048690B2

公开(公告)日：2011-11-01

申请号：US12513316

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： H01L21/00

CPC分类号： H01L21/6836 ,  C08K3/017 ,  C08K7/06 ,  C09J7/21 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/263 ,  G01L1/20 ,  G01R31/026 ,  G01R31/2886 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/3511 ,  Y10T428/24331 ,  Y10T428/28 ,  Y10T428/2848

摘要： A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

摘要翻译： 根据本发明的压敏粘合片是在基膜上设置压敏粘合剂层的压敏粘合片，其中基膜含有导电纤维，其中导电路径为 形成在压敏粘合剂层和基膜之间。 利用这种结构，即使在通过切割半导体晶片形成的半导体晶片或半导体芯片被施加的状态下，也可以进行电连续性测试，并且半导体晶片的变形（翘曲）和损坏以及缺陷和划痕的产生 在测试中可以防止背面。

公开(公告)号：US20100313667A1

公开(公告)日：2010-12-16

申请号：US12513230

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： G01L9/00 ,  H01L21/66

CPC分类号： G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

摘要： Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

摘要翻译： 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US08146438B2

公开(公告)日：2012-04-03

申请号：US12513230

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： G01L9/00

CPC分类号： G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

摘要： Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

摘要翻译： 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US20110065217A1

公开(公告)日：2011-03-17

申请号：US12513316

申请日：2008-10-09

申请人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

发明人： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC分类号： H01L21/66 ,  B32B7/12

CPC分类号： H01L21/6836 ,  C08K3/017 ,  C08K7/06 ,  C09J7/21 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/263 ,  G01L1/20 ,  G01R31/026 ,  G01R31/2886 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/3511 ,  Y10T428/24331 ,  Y10T428/28 ,  Y10T428/2848

摘要： A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test.

摘要翻译： 根据本发明的压敏粘合片是在基膜上设置压敏粘合剂层的压敏粘合片，其中基膜含有导电纤维，其中导电路径为 形成在压敏粘合剂层和基膜之间。 利用这种结构，即使在通过切割半导体晶片形成的半导体晶片或半导体芯片被施加的状态下，也可以进行电连续性测试，并且半导体晶片的变形（翘曲）和损坏以及缺陷和划痕的产生 在测试中可以防止背面。

公开(公告)号：US08822058B2

公开(公告)日：2014-09-02

申请号：US13944591

申请日：2013-07-17

申请人： Yoshio Terada ,  Akira Shouji ,  Kouki Tomioka ,  Kenji Furuta ,  Midori Tojo ,  Kazunori Hayashi ,  Shoujirou Moriki

发明人： Yoshio Terada ,  Akira Shouji ,  Kouki Tomioka ,  Kenji Furuta ,  Midori Tojo ,  Kazunori Hayashi ,  Shoujirou Moriki

IPC分类号： H01M10/50 ,  H01M10/04

摘要： An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.

公开(公告)号：US20140037924A1

公开(公告)日：2014-02-06

申请号：US14110479

申请日：2012-02-21

申请人： Kenji Furuta ,  Yoshio Terada ,  Midori Tojo ,  Koichi Nakamura

发明人： Kenji Furuta ,  Yoshio Terada ,  Midori Tojo ,  Koichi Nakamura

IPC分类号： C09J7/02

CPC分类号： C09J7/38 ,  C08K3/016 ,  C08K3/10 ,  C09J7/22 ,  C09J133/08 ,  C09J133/14 ,  C09J2201/622 ,  C09J2203/33 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2467/006 ,  H01M2/08 ,  H01M10/0525 ,  Y10T428/24959 ,  Y10T428/256 ,  Y10T428/266 ,  C08F2220/1858 ,  C08F2220/281 ,  C08F226/08 ,  C08F220/58

摘要： A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a substrate and a flame-retardant thermally-conductive pressure-sensitive adhesive layer provided on at least one surface of the substrate. The substrate includes a polyester film and the thickness of the polyester film is 10 to 40 μm, and the thermal resistance of the flame-retardant thermally-conductive pressure-sensitive adhesive sheet is 10 cm2·K/W or less.

摘要翻译： 阻燃性导热性粘合片包括基材和设置在基材的至少一个表面上的阻燃性导热性粘合剂层。 基材包括聚酯膜，聚酯膜的厚度为10〜40μm，阻燃性导热性粘合片的耐热性为10cm 2·K / W以下。

公开(公告)号：US08541099B2

公开(公告)日：2013-09-24

申请号：US12350764

申请日：2009-01-08

申请人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

发明人： Hirofumi Fujii ,  Yoshio Terada ,  Kazumasa Igarashi

IPC分类号： B32B27/06

CPC分类号： C08G73/1025 ,  C08G73/10 ,  C08K3/04 ,  C08K5/3432 ,  C08L79/08 ,  G03F7/0387 ,  Y10T428/254 ,  Y10T428/2822 ,  Y10T428/31663

摘要： The present invention provides a low-modulus low-stress resin which has such heat resistance that cohesive force and reliability can be retained even at high temperatures and which is applicable as various functional materials. The resin is a thermoplastic resin having a modulus of elasticity at room temperature, 25° C., of 1 GPa or lower and a modulus of elasticity at 250° C. of 1 MPa or higher, or a precursor resin thereof.

摘要翻译： 本发明提供一种低模量低应力树脂，其具有这样的耐热性，即使在高温下也可以保持内聚力和可靠性，并且可用作各种功能材料。 树脂是在室温，25℃，1GPa以下的弹性模量和250℃下的弹性模量为1MPa以上的热塑性树脂或其前体树脂。

公开(公告)号：US08524007B2

公开(公告)日：2013-09-03

申请号：US12977762

申请日：2010-12-23

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： B08B7/00 ,  B32B3/30 ,  B32B17/10

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

摘要翻译： 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0mum以下的最大高度Rz的微细度形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。

公开(公告)号：US20130041093A1

公开(公告)日：2013-02-14

申请号：US13642918

申请日：2011-05-13

申请人： Junichi Nakayama ,  Tatsuya Tsukagoshi ,  Yoshio Terada ,  Akira Shouji ,  Kenji Furuta ,  Midori Tojo

发明人： Junichi Nakayama ,  Tatsuya Tsukagoshi ,  Yoshio Terada ,  Akira Shouji ,  Kenji Furuta ,  Midori Tojo

IPC分类号： C09J133/08

CPC分类号： C09J133/00 ,  C08K3/38 ,  C08K2201/001 ,  C09J9/00

摘要： An object is to provide a thermally conductive adhesive sheet capable of making a heat generating body and a heat radiating body adhere to each other easily and with a sufficient adhesive force. Provided is a thermally conductive adhesive sheet including an adhesive agent layer formed by molding a thermally conductive adhesive agent composition including an acrylic polymer component into a sheet-like shape, wherein the adhesive force at the time of 180° peeling is 1 N/20 mm or more and the contact thermal resistance is 0.6 cm2·K/W or less when the adhesive sheet is pressure bonded to an adherend with a pressure of 200 kPa.

摘要翻译： 本发明的目的是提供一种能够使发热体和散热体容易地并且以足够的粘合力彼此附着的导热性粘合片。 提供了一种导热性粘合片，其包括通过将包含丙烯酸类聚合物组分的导热性粘合剂组合物成型为片状形成的粘合剂层，其中180°剥离时的粘合力为1N / 20mm 以上，粘合片在压力为200kPa的被粘物上粘合时，接触热阻为0.6cm 2·K / W以下。

公开(公告)号：US20120309879A1

公开(公告)日：2012-12-06

申请号：US13578318

申请日：2011-01-27

申请人： Kenji Furuta ,  Junichi Nakayama ,  Yoshio Terada ,  Takashi Wano

发明人： Kenji Furuta ,  Junichi Nakayama ,  Yoshio Terada ,  Takashi Wano

IPC分类号： C09J133/14 ,  C08K5/101 ,  C08K3/38 ,  C08K5/05

CPC分类号： C08K3/38 ,  C08K5/05 ,  C08K5/29 ,  C09J133/08

摘要： Provided is a method for producing a thermally-conductive adhesive sheet including a thermally-conductive adhesive agent layer by performing: a composition preparation step of preparing a thermally-conductive adhesive agent composition including a thermally-conductive particle and an acrylic polymer component; and an adhesive agent layer formation step of forming a sheet-shaped thermally-conductive adhesive agent layer with the thermally-conductive adhesive agent composition, wherein in the composition preparation step, a cyclic organic compound of 8 or less carbon atoms, or an organic compound of 3 or less carbon atoms having a hydroxy, ketone, aldehyde, carboxyl or nitrile group is mixed as a constitutional component of the thermally-conductive adhesive agent composition.

摘要翻译： 本发明提供一种制造导热性粘合剂片的方法，该导热性粘合片包括导热性粘合剂层，其通过以下步骤：制备包含导热颗粒和丙烯酸类聚合物组分的导热粘合剂组合物的组合物制备步骤; 以及粘合剂层形成步骤，用导热粘合剂组合物形成片状导热粘合剂层，其中在组合物制备步骤中，将碳原子数为8以下的环状有机化合物或有机化合物 具有羟基，酮，醛，羧基或腈基的3个以下碳原子作为导热性粘合剂组合物的构成成分混合。