Provided is a single wafer processing apparatus for cleaning a substrate. The apparatus includes a substrate support member including a spin head to place a substrate thereon, a processing bowl disposed to surround the spin head and adapted to collect a processing fluid scattering from the substrate, and a swing nozzle unit adapted to inject the processing fluid to the substrate placed on the spin head by rotating in a swinging motion, wherein the swing nozzle unit includes a nozzle part including a nozzle body constituted by an inner resin pipe supplying an inner path where a processing fluid supply tube is disposed, a metal pipe disposed to surround the inner resin pipe, and an outer resin pipe disposed to surround the metal pipe, and a nozzle driver adapted to rotate the nozzle part in a Θ-axis direction and move the nozzle part up and down in a z-axis direction.