- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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申请号: US12963847申请日: 2010-12-09
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公开(公告)号: US20110073934A1公开(公告)日: 2011-03-31
- 发明人: Tamae TAKANO , Tetsuya KAKEHATA , Shunpei YAMAZAKI
- 申请人: Tamae TAKANO , Tetsuya KAKEHATA , Shunpei YAMAZAKI
- 申请人地址: JP Atsugi-shi
- 专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: JP Atsugi-shi
- 优先权: JP2007-173103 20070629
- 主分类号: H01L29/792
- IPC分类号: H01L29/792
摘要:
The invention provides a semiconductor device and its manufacturing method in which a memory transistor and a plurality of thin film transistors that have gate insulating films with different thicknesses are fabricated over a substrate. The invention is characterized by the structural difference between the memory transistor and the plurality of thin film transistors. Specifically, the memory transistor and some of the plurality of thin film transistors are provided to have a bottom gate structure while the other thin film transistors are provided to have a top gate structure, which enables the reduction of characteristic defects of the transistor and simplification of its manufacturing process.
公开/授权文献
- US08022469B2 Semiconductor device and manufacturing method thereof 公开/授权日:2011-09-20
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