发明申请
- 专利标题: RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 刚性柔性电路板及其制造方法
-
申请号: US12618726申请日: 2009-11-14
-
公开(公告)号: US20110075374A1公开(公告)日: 2011-03-31
- 发明人: Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
- 申请人: Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
- 优先权: KR10-2009-0091198 20090925
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H05K1/00 ; H05K3/10
摘要:
Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.