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    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
    加热基板及其制造方法

    公开(公告)号：US20110304990A1

    公开(公告)日：2011-12-15

    申请号：US12884058

    申请日：2010-09-16

    申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    IPC分类号： H05K7/20 ,  B32B38/04 ,  B32B38/10 ,  H05K1/00 ,  B32B37/02

    CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

    摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    加热基板及其制造方法

    公开(公告)号：US20110303437A1

    公开(公告)日：2011-12-15

    申请号：US12911620

    申请日：2010-10-25

    申请人： Chang Hyun LIM ,  Jung Eun KANG ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

    发明人： Chang Hyun LIM ,  Jung Eun KANG ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

    IPC分类号： H05K1/00 ,  H05B3/00

    CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K2201/049 ,  H05K2201/062 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/49083

    摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括芯层，芯层包括芯金属层和形成在芯金属层上的芯绝缘层，并分成第一区域和第二区域; 形成在芯层的第一区域中的电路层; 以及形成在芯层的第二区域中并包括积聚绝缘层和积聚电路层的堆积层。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱元件被发热元件产生的热量损坏。

    Heat-radiating substrate and manufacturing method thereof
    5.
    发明授权
    Heat-radiating substrate and manufacturing method thereof 有权
    散热基板及其制造方法

    公开(公告)号：US08338714B2

    公开(公告)日：2012-12-25

    申请号：US12852323

    申请日：2010-08-06

    申请人： Jung Eun Kang ,  Hye Sook Shin ,  Ki Ho Seo

    发明人： Jung Eun Kang ,  Hye Sook Shin ,  Ki Ho Seo

    IPC分类号： H05K1/00

    CPC分类号： H05K3/445 ,  H01L2924/0002 ,  H05K3/4608 ,  H05K3/465 ,  H05K2201/0116 ,  H05K2203/0315 ,  H05K2203/1147 ,  Y10T29/49128 ,  H01L2924/00

    摘要： Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. Further, in the heat-radiating substrate of the present embodiment, the first circuit layer is partially filled in the second pores and the second insulating layer is filled in the second pores to make a plane the first insulating layer. In addition, disclosed is a method of manufacturing the heat-radiating substrate.

    摘要翻译： 本文公开了一种散热基板。 散热基板包括：金属芯层; 形成在所述金属芯层的一侧或两侧的第一绝缘层包括与所述金属芯层接触的沐浴层，具有不同直径的第一和第二孔以及与所述沐浴层连接的多孔层; 第一电路层，其被嵌入在所述第一绝缘层中，填充在所述多孔层的第二孔中，并且连接到所述第二孔的侧面; 以及形成在第一绝缘层的多孔层上的第二绝缘层。 此外，在本实施方式的散热基板中，第一电路层部分地填充在第二孔中，第二绝缘层填充在第二孔中，以使第一绝缘层成为平面。 此外，公开了制造散热基板的方法。

    Heat-radiating substrate and method of manufacturing the same
    6.
    发明授权
    Heat-radiating substrate and method of manufacturing the same 有权
    散热基板及其制造方法

    公开(公告)号：US08315056B2

    公开(公告)日：2012-11-20

    申请号：US12884058

    申请日：2010-09-16

    申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

    IPC分类号： H05K7/20 ,  H05K1/03

    CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

    摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

    Rigid-flexible circuit board and method of manufacturing the same
    10.
    发明授权
    Rigid-flexible circuit board and method of manufacturing the same 失效
    刚性柔性电路板及其制造方法

    公开(公告)号：US08198543B2

    公开(公告)日：2012-06-12

    申请号：US12618726

    申请日：2009-11-14

    申请人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

    发明人： Jung Eun Kang ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Chang Hyun Lim

    IPC分类号： H05K1/00

    CPC分类号： H05K3/4641 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/189 ,  H05K3/462 ,  H05K3/4691 ,  H05K2203/0315 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.

    摘要翻译： 公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路 并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得 刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。 还提供了制造刚性柔性电路板的方法。