Invention Application
US20110079872A1 PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC SYSTEM HAVING THE PASSIVE DEVICE, AND METHODS OF FABRICATING AND INSPECTING THE SEMICONDUCTOR MODULE
审中-公开
被动装置，半导体模块，电子电路板和具有被动装置的电子系统，以及制造和检查半导体模块的方法
- Patent Title: PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC SYSTEM HAVING THE PASSIVE DEVICE, AND METHODS OF FABRICATING AND INSPECTING THE SEMICONDUCTOR MODULE
- Patent Title (中): 被动装置，半导体模块，电子电路板和具有被动装置的电子系统，以及制造和检查半导体模块的方法
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Application No.: US12772351Application Date: 2010-05-03
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Publication No.: US20110079872A1Publication Date: 2011-04-07
- Inventor: Seong-Chan HAN , Jin-Kyu Yang , Jae-Young Kim , Kwang-Su Yu
- Applicant: Seong-Chan HAN , Jin-Kyu Yang , Jae-Young Kim , Kwang-Su Yu
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR Suwon-si
- Priority: KR2009-0094833 20091006
- Main IPC: H01L29/86
- IPC: H01L29/86
Abstract:
Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.
Information query
IPC分类:
