公开(公告)号：US20110079872A1

公开(公告)日：2011-04-07

申请号：US12772351

申请日：2010-05-03

申请人： Seong-Chan HAN ,  Jin-Kyu Yang ,  Jae-Young Kim ,  Kwang-Su Yu

发明人： Seong-Chan HAN ,  Jin-Kyu Yang ,  Jae-Young Kim ,  Kwang-Su Yu

IPC分类号： H01L29/86

CPC分类号： H05K1/023 ,  H01L24/16 ,  H01L29/86 ,  H01L2224/16 ,  H01L2924/01077 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19015 ,  H05K1/0269 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/09181 ,  H05K2201/09781 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

摘要： Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.

摘要翻译： 提供半导体模块的无源器件，具有无源器件的半导体模块，具有无源器件或半导体模块的电子电路板和电子系统以及制造和检查半导体模块的方法。 半导体模块的无源器件包括主体和设置在主体的一个侧表面上的至少两个实际电极。

公开(公告)号：US20090257209A1

公开(公告)日：2009-10-15

申请号：US12385575

申请日：2009-04-13

申请人： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

发明人： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

IPC分类号： H01R9/00 ,  H01R12/04

CPC分类号： H05K1/112 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

摘要： A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

摘要翻译： 一种半导体封装和相关方法，所述半导体封装包括包括插座的衬底以及包括焊球和从所述焊球延伸到所述插座中的支撑部分的连接端子。

公开(公告)号：US20060151315A1

公开(公告)日：2006-07-13

申请号：US11330517

申请日：2006-01-11

申请人： Jin-Kyu Yang ,  Yoea-Sang Yoon ,  Jong-Seo Yoon

发明人： Jin-Kyu Yang ,  Yoea-Sang Yoon ,  Jong-Seo Yoon

IPC分类号： C25D17/00

CPC分类号： C25D17/004 ,  C25D7/0628

摘要： Disclosed is an apparatus for manufacturing an electrolytic metal foil, which includes an electrolytic cell containing electrolyte; an upper drum installed in an upper portion of the electrolytic cell to be rotatable and to which a negative potential is applied; a lower drum soaked in the electrolyte of the electrolytic cell and installed to be rotatable together with the upper drum; a cathode belt mounted around outer circumferences of the upper and lower drums to move along an endless track and electrically connected to the upper drum so that the negative potential is applied thereto; and an anode unit installed to form a space from a metal electroplating surface of the cathode belt soaked in the electrolytic cell so that a positive potential is applied thereto, the anode unit having a slit for supplying the electrolytic to the space. This apparatus may increase a production rate of electrolytic metal foils.

摘要翻译： 公开了一种电解金属箔的制造装置，其包括含有电解质的电解槽; 安装在所述电解槽的上部以便旋转并且施加负电位的上鼓; 浸在电解槽的电解质中并被安装成与上鼓一起旋转的下鼓; 安装在所述上鼓和下鼓的外圆周周围的阴极带沿着环形轨道移动并且电连接到所述上鼓，以使所述负电位施加到所述上鼓; 以及阳极单元，其被安装成从浸泡在所述电解池中的所述阴极带的金属电镀表面形成空间，使得施加正电位，所述阳极单元具有用于向所述空间供应电解质的狭缝。 该装置可以提高电解金属箔的生产率。

公开(公告)号：US07920383B2

公开(公告)日：2011-04-05

申请号：US12265101

申请日：2008-11-05

申请人： Jin-Kyu Yang ,  Dong-Woo Shin ,  Hyun-Jong Oh

发明人： Jin-Kyu Yang ,  Dong-Woo Shin ,  Hyun-Jong Oh

IPC分类号： H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes first and second base plates to contact with first and second surfaces of a heat source, respectively. The first base plate includes a support unit protruding from a first surface and a first dissipating unit to dissipate heat from the heat source. The second base plate includes a penetrating hole spaced apart from an edge portion to hold the support unit and a second dissipating unit to dissipate the heat from the heat source. A coupling member is positioned on an upper surface of the support unit and applies a force to the first and second base plates to thereby combine the first and second base plates to the heat source. The base plates are combined to the memory module without any loss of the surface area of the dissipating fin, to thereby improve the dissipation efficiency of the heat sink.

摘要翻译： 散热器包括分别与热源的第一和第二表面接触的第一和第二基板。 第一基板包括从第一表面突出的支撑单元和第一散热单元，以从热源散发热量。 第二基板包括与边缘部分间隔开以保持支撑单元的穿透孔和用于消散来自热源的热量的第二消散单元。 联接构件定位在支撑单元的上表面上，并且向第一和第二基板施加力，从而将第一和第二基板组合到热源。 将基板组合到存储器模块中，而不会损耗散热片的表面积，从而提高散热器的散热效率。

公开(公告)号：US07641775B2

公开(公告)日：2010-01-05

申请号：US11330517

申请日：2006-01-11

申请人： Jin-Kyu Yang ,  Yoea-Sang Yoon ,  Jong-Seo Yoon

发明人： Jin-Kyu Yang ,  Yoea-Sang Yoon ,  Jong-Seo Yoon

IPC分类号： C25D17/00

CPC分类号： C25D17/004 ,  C25D7/0628

摘要： Disclosed is an apparatus for manufacturing an electrolytic metal foil, which includes an electrolytic cell containing electrolyte; an upper drum installed in an upper portion of the electrolytic cell to be rotatable and to which a negative potential is applied; a lower drum soaked in the electrolyte of the electrolytic cell and installed to be rotatable together with the upper drum; a cathode belt mounted around outer circumferences of the upper and lower drums to move along an endless track and electrically connected to the upper drum so that the negative potential is applied thereto; and an anode unit installed to form a space from a metal electroplating surface of the cathode belt soaked in the electrolytic cell so that a positive potential is applied thereto, the anode unit having a slit for supplying the electrolytic to the space. This apparatus may increase a production rate of electrolytic metal foils.

摘要翻译： 公开了一种电解金属箔的制造装置，其包括含有电解质的电解槽; 安装在所述电解槽的上部以便旋转并且施加负电位的上鼓; 浸在电解槽的电解质中并被安装成与上鼓一起旋转的下鼓; 安装在所述上鼓和下鼓的外圆周周围的阴极带沿着环形轨道移动并且电连接到所述上鼓，以使所述负电位施加到所述上鼓; 以及阳极单元，其被安装成从浸泡在所述电解池中的所述阴极带的金属电镀表面形成空间，使得施加正电位，所述阳极单元具有用于向所述空间供应电解质的狭缝。 该装置可以提高电解金属箔的生产率。

公开(公告)号：US08373928B2

公开(公告)日：2013-02-12

申请号：US12105641

申请日：2008-04-18

申请人： Jae-Heung Ha ,  Kyu-Hwan Hwang ,  Sang-Hwan Cho ,  Young-Woo Song ,  Jong-Hyuk Lee ,  Yong-Hee Lee ,  Jin-Kyu Yang

发明人： Jae-Heung Ha ,  Kyu-Hwan Hwang ,  Sang-Hwan Cho ,  Young-Woo Song ,  Jong-Hyuk Lee ,  Yong-Hee Lee ,  Jin-Kyu Yang

IPC分类号： G02B5/30

CPC分类号： G02B5/3058 ,  H01L27/3244 ,  H01L51/5281

摘要： A polarizer includes a base and a plurality of grids arranged on a surface of the base parallel to one another. Each of the grids comprises an intermediate layer and a semi-transmissive metal layer that reflects a part of external light incident thereon and transmits a part of the external light incident thereon. The semi-transmissive metal layer and the intermediate layer are alternately deposited to include at least two semi-transmissive metal layers. The thicknesses of the semi-transmissive metal layers increases in a direction in which the semi-transmissive metal layer is disposed away from the external light. An organic light emitting display apparatus includes the polarizer and has improved contrast and brightness.

摘要翻译： 偏振器包括基部和布置在基部的彼此平行的表面上的多个格栅。 每个栅格包括反射入射在其上的外部光的一部分的中间层和半透射金属层，并透射入射在其上的一部分外部光。 交替沉积半透射金属层和中间层以包括至少两个半透射金属层。 半透射金属层的厚度在半透射金属层远离外部光的方向上增加。 有机发光显示装置包括偏振器，并且具有改善的对比度和亮度。

公开(公告)号：US20100006260A1

公开(公告)日：2010-01-14

申请号：US12496930

申请日：2009-07-02

申请人： Hyun-Jong OH ,  Chan-Hyung Yun ,  Dong-Woo Shin ,  Jin-Kyu Yang ,  Jae-Chan Lee

发明人： Hyun-Jong OH ,  Chan-Hyung Yun ,  Dong-Woo Shin ,  Jin-Kyu Yang ,  Jae-Chan Lee

IPC分类号： F28F3/00

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink includes a base plate and at least one elastic plate. The base plate is connected to a heat generator such as a semiconductor chip. One end portion of the elastic plate is connected to the base plate and the elastic plate has a zigzag structure to ensure desired elasticity. The elastic plate dissipates the heat generated from the heat generator.

摘要翻译： 散热器包括基板和至少一个弹性板。 底板连接到诸如半导体芯片的发热体。 弹性板的一个端部连接到基板，并且弹性板具有锯齿形结构以确保期望的弹性。 弹性板消散了发热体产生的热量。