发明申请
- 专利标题: Multilayer rigid flexible printed circuit board and method for manufacturing the same
- 专利标题(中): 多层刚性柔性印刷电路板及其制造方法
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申请号: US12923994申请日: 2010-10-19
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公开(公告)号: US20110094776A1公开(公告)日: 2011-04-28
- 发明人: Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
- 申请人: Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2009-0102783 20091028
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H05K3/00
摘要:
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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