发明申请
US20110094776A1 Multilayer rigid flexible printed circuit board and method for manufacturing the same 有权
多层刚性柔性印刷电路板及其制造方法

Multilayer rigid flexible printed circuit board and method for manufacturing the same
摘要:
The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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