公开(公告)号：US20080257742A1

公开(公告)日：2008-10-23

申请号：US12007243

申请日：2008-01-08

申请人： Yang Je Lee ,  Going Sik Kim ,  Dong Gi An ,  Mi Jung Han ,  Kyung Jin Heo ,  Young Kyu Lim

发明人： Yang Je Lee ,  Going Sik Kim ,  Dong Gi An ,  Mi Jung Han ,  Kyung Jin Heo ,  Young Kyu Lim

IPC分类号： C25D5/02

CPC分类号： H05K3/244 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K3/243 ,  H05K2201/0391 ,  H05K2203/072 ,  H05K2203/0723 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a printed circuit board for a semiconductor package, which minimizes or completely obviates masking work upon the plating of each pad for the surface treatment of a printed circuit board for a semiconductor package, thereby simplifying the overall process and increasing the mounting reliability.

摘要翻译： 公开了一种制造用于半导体封装的印刷电路板的方法，其最小化或完全避免了用于半导体封装的印刷电路板的表面处理的每个焊盘的电镀时的掩蔽工作，从而简化了整个工艺并增加了 安装可靠性。

公开(公告)号：US20100147563A1

公开(公告)日：2010-06-17

申请号：US12476802

申请日：2009-06-02

申请人： Young Po Park ,  Going Sik Kim ,  Hwan Yong Jung ,  Ha II Kim ,  Dong Gi An ,  Myeong Hui Jung

发明人： Young Po Park ,  Going Sik Kim ,  Hwan Yong Jung ,  Ha II Kim ,  Dong Gi An ,  Myeong Hui Jung

IPC分类号： H05K1/11

CPC分类号： H05K1/0218 ,  H05K3/28 ,  H05K3/4691 ,  H05K2201/0715 ,  H05K2201/09627

摘要： Disclosed is a substrate having an electromagnetic shielding member, which includes a first circuit layer connected to a ground layer, a coverlay formed on the first circuit layer, an electromagnetic shielding member formed on the coverlay, and a first via formed in the coverlay to connect the electromagnetic shielding member to the first circuit layer, so that the electromagnetic shielding member and the ground layer are connected to each other through a via structure, thereby preventing the electromagnetic shielding member from becoming cracked due to the stepped portion of the substrate.

摘要翻译： 公开了具有电磁屏蔽构件的基板，其包括连接到接地层的第一电路层，形成在第一电路层上的覆盖层，形成在覆盖层上的电磁屏蔽构件，以及形成在覆盖层中以连接的第一通孔 电磁屏蔽构件通过通孔结构彼此连接，从而防止电磁屏蔽构件由于基板的阶梯部而变得破裂。

公开(公告)号：US08631567B2

公开(公告)日：2014-01-21

申请号：US12719618

申请日：2010-03-08

申请人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

发明人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC分类号： H05K3/02 ,  H05K3/10

CPC分类号： H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

摘要： A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，在分别形成有内部电路图案的两侧的柔性铜箔层压体的两面分别形成有覆盖层的基板， 在作为柔性铜箔层压体的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在所述刚性区域中形成通孔，同时在所述覆盖层中形成柔性区域中的第一窗口; 形成包括与第一窗口相邻的区域的外部电路图案; 以及在所述刚性区域中施加阻焊剂以暴露所述外部电路图案的部分，其中形成在与所述第一窗口相邻的区域中的外部电路图案包括用于覆盖所述覆盖层的部分的附加电镀部分。

公开(公告)号：US08558116B2

公开(公告)日：2013-10-15

申请号：US12923994

申请日：2010-10-19

申请人： Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

发明人： Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

IPC分类号： H05K1/00

CPC分类号： H05K3/06 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0707 ,  H05K2203/0554 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

摘要翻译： 本发明提供了一种多层刚性柔性印刷电路板，包括：柔性区域，包括柔性膜，其具有形成在其一个或两个表面上的电路图案和形成在电路图案上的激光阻挡层; 以及刚性区域，其形成在柔性区域附近，并且在延伸到柔性区域的柔性膜的两侧的延伸部分的一个或两个表面上包括多个图案层及其制造方法。

公开(公告)号：US20080014768A1

公开(公告)日：2008-01-17

申请号：US11708456

申请日：2007-02-21

申请人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

发明人： Yang Je Lee ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

摘要： The present invention relates to a rigid-flexible printed circuit board and, more particularly, to a rigid-flexible printed circuit board including CL via holes which can facilitate electrical connection to an inner circuit pattern in a flexible region. Since the coverlays are layered on the entire surface of the double-sided FCCL without previous processing thereof, the via holes are formed in the coverlays while a drilling process is performed to form the via holes, and then the copper plating is performed over the entire surface thereof, it is possible to eliminate the cost of previously processing the coverlays, easily perform a process of provisionally layering the coverlays on the double-sided FCCL, and decrease the cost therefor.

摘要翻译： 本发明涉及刚性柔性印刷电路板，更具体地说，涉及一种刚性柔性印刷电路板，其包括CL通孔，其可以促进与柔性区域内部电路图形的电连接。 由于覆盖层在双面FCCL的整个表面上层叠而不进行前处理，所以在执行钻孔处理以形成通孔的同时，在覆盖层中形成通孔，然后在整个过程中执行镀铜 表面，可以消除预先处理覆盖层的成本，容易地执行在双面FCCL上临时层叠覆盖层的处理，并降低其成本。

公开(公告)号：US20110094776A1

公开(公告)日：2011-04-28

申请号：US12923994

申请日：2010-10-19

申请人： Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

发明人： Yang Je Lee ,  Dek Gin Yang ,  Dong Gi An ,  Jae Ho Shin

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/06 ,  H05K1/0218 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/0707 ,  H05K2203/0554 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.

摘要翻译： 本发明提供了一种多层刚性柔性印刷电路板，包括：柔性区域，包括柔性膜，其具有形成在其一个或两个表面上的电路图案和形成在电路图案上的激光阻挡层; 以及刚性区域，其形成在柔性区域附近，并且在延伸到柔性区域的柔性膜的两侧的延伸部分的一个或两个表面上包括多个图案层及其制造方法。

公开(公告)号：US20100155108A1

公开(公告)日：2010-06-24

申请号：US12457002

申请日：2009-05-28

申请人： Chul Min Lee ,  Sung Wook Chun ,  Dek Gin Yang ,  Kyung Jin Heo ,  Young Ho Lee ,  Dong-Gi An

发明人： Chul Min Lee ,  Sung Wook Chun ,  Dek Gin Yang ,  Kyung Jin Heo ,  Young Ho Lee ,  Dong-Gi An

IPC分类号： H05K1/00 ,  B05D5/12 ,  C09D1/00 ,  C08K3/10

CPC分类号： C23C18/34 ,  H05K1/118 ,  H05K3/244

摘要： The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

摘要翻译： 本发明涉及一种化学镀镍溶液组合物，柔性印刷电路板及其制造方法，更具体地，涉及一种能够同时满足电镀的化学镀镍溶液组合物，柔性印刷电路板及其制造方法 通过与含有水溶性镍化合物，还原剂，络合剂的化学镀镍溶液组合物形成具有垂直生长结构的镀镍层，分别为柔性印刷电路板的焊盘单元和外部连接单元需要的特性 和垂直生长诱导剂。

公开(公告)号：US20100162562A1

公开(公告)日：2010-07-01

申请号：US12719618

申请日：2010-03-08

申请人： Yang Je LEE ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

发明人： Yang Je LEE ,  Il Woon Shin ,  Going Sik Kim ,  Doo Pyo Hong ,  Ha Il Kim ,  Dong Gi An

IPC分类号： H05K3/10

CPC分类号： H05K3/429 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4664 ,  H05K3/4691 ,  H05K2201/0195 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2203/054 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49171

摘要： A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，在分别形成有内部电路图案的两侧的柔性铜箔层压体的两面分别形成有覆盖层的基板， 在作为柔性铜箔层压体的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在所述刚性区域中形成通孔，同时在所述覆盖层中形成柔性区域中的第一窗口; 形成包括与第一窗口相邻的区域的外部电路图案; 以及在所述刚性区域中施加阻焊剂以暴露所述外部电路图案的部分，其中形成在与所述第一窗口相邻的区域中的外部电路图案包括用于覆盖所述覆盖层的部分的附加电镀部分。

公开(公告)号：US07281328B2

公开(公告)日：2007-10-16

申请号：US11253973

申请日：2005-10-18

申请人： Yang Je Lee ,  Dek Gin Yang ,  Jung Wook Hwang ,  Kyu Hyok Yim ,  Jung Hun Chai ,  Young Ho Lee ,  Kwang Yune Kim ,  Dong Gi An

发明人： Yang Je Lee ,  Dek Gin Yang ,  Jung Wook Hwang ,  Kyu Hyok Yim ,  Jung Hun Chai ,  Young Ho Lee ,  Kwang Yune Kim ,  Dong Gi An

IPC分类号： H01K3/10

CPC分类号： H05K3/4691 ,  H05K3/28 ,  H05K3/4652 ,  H05K2201/09127 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The present invention is related to a method of fabricating a rigid-flexible printed circuit board. Specifically, this invention relates to a method of fabricating a rigid-flexible printed circuit board, in which an internal circuit pattern exposed for use in an external pad and a mounting pad is protected from external environments using a resist cover by window etching the base copper foil of a flexible region upon formation of an external circuit pattern as opposed to using a resist cover. Thus the number of fabrication processes and the fabrication costs are decreased and the increase in defect rates due to contamination is prevented, resulting in maximized reliability.

摘要翻译： 本发明涉及制造刚挠柔性印刷电路板的方法。 具体地说，本发明涉及一种刚性柔性印刷电路板的制造方法，其中使用外部焊盘和安装焊盘露出的内部电路图案通过窗口蚀刻基底铜而被保护免受外部环境的影响 在形成外部电路图案时，与使用抗蚀剂盖相反，柔性区域的箔片。 因此，制造工艺的数量和制造成本降低，并且防止了由于污染引起的缺陷率的增加，导致最大的可靠性。