发明申请
- 专利标题： Thermoelectric 3D Cooling
- 专利标题（中）： 热电3D冷却
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申请号： US12985360申请日： 2011-01-06
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公开(公告)号： US20110104846A1公开(公告)日： 2011-05-05
- 发明人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
- 申请人： Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/71
- IPC分类号： H01L21/71
摘要：
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
公开/授权文献
- US08030113B2 Thermoelectric 3D cooling 公开/授权日：2011-10-04
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