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公开(公告)号:US08030113B2
公开(公告)日:2011-10-04
申请号:US12985360
申请日:2011-01-06
申请人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
发明人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
CPC分类号: H01L23/481 , H01L25/0657 , H01L27/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , Y10S257/93 , H01L2924/00
摘要: The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
摘要翻译: 本发明包括具有中间热电耦合(TEC)板的3D芯片堆叠。 通过3D芯片堆叠中的硅通孔在3D堆叠中的芯片之间传送电子信号,为TEC板供电,以及将堆叠中的热量从较热的芯片分配到较冷的芯片。
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公开(公告)号:US07893529B2
公开(公告)日:2011-02-22
申请号:US12351878
申请日:2009-01-12
申请人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
发明人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
CPC分类号: H01L23/481 , H01L25/0657 , H01L27/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , Y10S257/93 , H01L2924/00
摘要: The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
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公开(公告)号:US20100176506A1
公开(公告)日:2010-07-15
申请号:US12351878
申请日:2009-01-12
申请人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
发明人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
IPC分类号: H01L23/36 , H01L21/3205
CPC分类号: H01L23/481 , H01L25/0657 , H01L27/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , Y10S257/93 , H01L2924/00
摘要: The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
摘要翻译: 本发明包括具有中间热电耦合(TEC)板的3D芯片堆叠。 通过3D芯片堆叠中的硅通孔在3D堆叠中的芯片之间传送电子信号,为TEC板供电,以及将堆叠中的热量从较热的芯片分配到较冷的芯片。
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公开(公告)号:US20110104846A1
公开(公告)日:2011-05-05
申请号:US12985360
申请日:2011-01-06
申请人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
发明人: Louis Lu-Chen Hsu , Ping-Chuan Wang , Xiaojin Wei , Huilong Zhu
IPC分类号: H01L21/71
CPC分类号: H01L23/481 , H01L25/0657 , H01L27/16 , H01L2225/06513 , H01L2225/06541 , H01L2225/06589 , H01L2924/0002 , Y10S257/93 , H01L2924/00
摘要: The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
摘要翻译: 本发明包括具有中间热电耦合(TEC)板的3D芯片堆叠。 通过3D芯片堆叠中的硅通孔在3D堆叠中的芯片之间传送电子信号,为TEC板供电,以及将堆叠中的热量从较热的芯片分配到较冷的芯片。
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公开(公告)号:US20100277210A1
公开(公告)日:2010-11-04
申请号:US12432801
申请日:2009-04-30
IPC分类号: H03L7/06
摘要: a central reference clock is placed in a substantially middle chip of a 3-D chip-stack. The central reference clock is distributed to each child chip of the 3-D chip-stack, so that a plurality of clocks is generated for each individual chip in the 3-D-stack in a synchronous manner. A predetermined number of through-silicon-vias and on-chip wires are employed to form a delay element for each slave clock, ensuring that the clock generated for each child chip is substantially synchronized. Optionally, an on-chip clock trimming circuit is embedded for further precision tuning to eliminate local clock skews.
摘要翻译: 中心参考时钟被放置在3-D芯片堆叠的基本上中间的芯片中。 中心参考时钟被分配给3-D芯片组的每个子芯片,从而以同步的方式为3-D堆叠中的每个芯片生成多个时钟。 采用预定数量的通硅通孔和片上导线来形成每个从时钟的延迟元件,确保为每个子芯片生成的时钟基本上同步。 可选地,嵌入式片上时钟微调电路用于进一步精确调谐以消除本地时钟偏移。
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公开(公告)号:US20100261318A1
公开(公告)日:2010-10-14
申请号:US12822459
申请日:2010-06-24
申请人: Kai Di Feng , Louis Lu-Chen Hsu , Ping-Chuan Wang , Zhijian Yang
发明人: Kai Di Feng , Louis Lu-Chen Hsu , Ping-Chuan Wang , Zhijian Yang
IPC分类号: H01L21/82
CPC分类号: H01L21/76898 , H01L23/481 , H01L23/5256 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184 , H01L2224/0557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/05684 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/3011 , H01L2924/00014
摘要: Programmable fuse-type through silicon vias (TSVs) in silicon chips are provided with non-programmable TSVs in the same chip. The programmable fuse-type TSVs may employ a region within the TSV structure having sidewall spacers that restrict the cross-sectional conductive path of the TSV adjacent a chip surface contact pad. Application of sufficient current by programming circuitry causes electromigration of metal to create a void in the contact pad and, thus, an open circuit. Programming may be carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
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公开(公告)号:US07863960B2
公开(公告)日:2011-01-04
申请号:US12432801
申请日:2009-04-30
IPC分类号: G06F1/04
摘要: A central reference clock is placed in a substantially middle chip of a 3-D chip-stack. The central reference clock is distributed to each child chip of the 3-D chip-stack, so that a plurality of clocks is generated for each individual chip in the 3-D-stack in a synchronous manner. A predetermined number of through-silicon-vias and on-chip wires are employed to form a delay element for each slave clock, ensuring that the clock generated for each child chip is substantially synchronized. Optionally, an on-chip clock trimming circuit is embedded for further precision tuning to eliminate local clock skews.
摘要翻译: 中心参考时钟被放置在3-D芯片堆叠的基本上中间的芯片中。 中心参考时钟被分配给3-D芯片组的每个子芯片,从而以同步的方式为3-D堆叠中的每个芯片生成多个时钟。 采用预定数量的通硅通孔和片上导线来形成每个从时钟的延迟元件,确保为每个子芯片生成的时钟基本上同步。 可选地,嵌入式片上时钟微调电路用于进一步精确调谐以消除本地时钟偏移。
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公开(公告)号:US08211756B2
公开(公告)日:2012-07-03
申请号:US12822459
申请日:2010-06-24
申请人: Kai Di Feng , Louis Lu-Chen Hsu , Ping-Chuan Wang , Zhijian Yang
发明人: Kai Di Feng , Louis Lu-Chen Hsu , Ping-Chuan Wang , Zhijian Yang
IPC分类号: H01L21/82
CPC分类号: H01L21/76898 , H01L23/481 , H01L23/5256 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184 , H01L2224/0557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/05684 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/3011 , H01L2924/00014
摘要: Programmable fuse-type through silicon vias (TSVs) in silicon chips are provided with non-programmable TSVs in the same chip. The programmable fuse-type TSVs may employ a region within the TSV structure having sidewall spacers that restrict the cross-sectional conductive path of the TSV adjacent a chip surface contact pad. Application of sufficient current by programming circuitry causes electromigration of metal to create a void in the contact pad and, thus, an open circuit. Programming may be carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
摘要翻译: 硅芯片中的可编程熔丝式硅通孔(TSV)在同一芯片中提供非可编程TSV。 可编程保险丝型TSV可以采用TSV结构内的区域,其具有侧壁间隔件,其限制邻近芯片表面接触焊盘的TSV的横截面导电路径。 通过编程电路施加足够的电流导致金属的电迁移,从而在接触焊盘中产生空隙,并因此产生开路。 编程可以由多层芯片堆叠中的两个相邻芯片上的互补电路来执行。
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公开(公告)号:US20100327958A1
公开(公告)日:2010-12-30
申请号:US12494460
申请日:2009-06-30
CPC分类号: H03K17/0822
摘要: A dormant mode target semiconductor device within a leakage current target unit is identified for mitigating leakage current to prevent it from reaching catastrophic runaway. A leakage current shift monitor unit is electrically connected to the output node of the leakage current target unit and collects leakage current from the selected target semiconductor device for two consecutive predefined temporal periods and measures the difference between the collected leakage currents. A comparator receives and compares the outputs of the current shift monitor unit and a reference voltage generator. The comparator propagates an alert signal to the leakage current target unit when the leakage voltage output from the leakage current shift monitor unit exceeds the reference voltage, a condition that indicates that the leakage current is about to approach catastrophic runaway levels. This alert signal switches the target semiconductor device to an active mode for leakage mitigation, which includes a repair voltage from a repair voltage generator applied to the gate of the target semiconductor device.
摘要翻译: 识别泄漏电流目标单元内的休眠模式目标半导体器件,以减轻漏电流,防止其达到灾难性的失控。 泄漏电流移动监视器单元电连接到泄漏电流目标单元的输出节点,并在两个连续的预定义时间周期内从所选择的目标半导体器件收集泄漏电流,并测量所收集的漏电流之间的差异。 比较器接收并比较当前移位监视器单元和参考电压发生器的输出。 当从泄漏电流移动监视器单元输出的泄漏电压超过参考电压时,比较器将报警信号传播到泄漏电流目标单元,表示泄漏电流即将接近灾难性失控水平的条件。 该警报信号将目标半导体器件切换到用于泄漏减轻的活动模式,其包括施加到目标半导体器件的栅极的修复电压发生器的修复电压。
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公开(公告)号:US20100182041A1
公开(公告)日:2010-07-22
申请号:US12357664
申请日:2009-01-22
申请人: Kai Di Feng , Louis Lu-Chen Hsu , Ping-Chuan Wang , Zhijian Yang
发明人: Kai Di Feng , Louis Lu-Chen Hsu , Ping-Chuan Wang , Zhijian Yang
IPC分类号: H03K19/173 , H01L29/00 , H01L29/40 , H01L21/44 , H01L23/02
CPC分类号: H01L21/76898 , H01L23/481 , H01L23/5256 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05147 , H01L2224/05184 , H01L2224/0557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/05684 , H01L2224/16 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/3011 , H01L2924/00014
摘要: Programmable fuse-type through silicon vias (TSVs) in silicon chips are provided with non-programmable TSVs in the same chip. The programmable fuse-type TSVs may employ a region within the TSV structure having sidewall spacers that restrict the cross-sectional conductive path of the TSV adjacent a chip surface contact pad. Application of sufficient current by programming circuitry causes electromigration of metal to create a void in the contact pad and, thus, an open circuit. Programming may be carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
摘要翻译: 硅芯片中的可编程熔丝式硅通孔(TSV)在同一芯片中提供非可编程TSV。 可编程保险丝型TSV可以采用TSV结构内的区域,其具有侧壁间隔件,其限制邻近芯片表面接触焊盘的TSV的横截面导电路径。 通过编程电路施加足够的电流导致金属的电迁移,从而在接触焊盘中产生空隙,并因此产生开路。 编程可以由多层芯片堆叠中的两个相邻芯片上的互补电路来执行。
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