Provided is a laser processing method capable of improving precision of a processing shape and degree of freedom of the processing shape. When a recess portion is formed in a substrate (W) which is an object to be processed, an inner portion of the substrate (W) is scanned with a condensing point (LS1) of modification laser light (L1) which is first laser light to form a modified layer (Wr) which becomes a boundary of a laser processing region (R1) in a position corresponding to a bottom part of the recess portion (modified layer forming step). Next, a surface (Wa) of the substrate (W) is irradiated with condensed processing laser light which is second laser light to remove and process the laser processing region (R1) defined by the modified layer (Wr), to thereby form the recess portion (removing/processing step).