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    Ink jet head and method of manufacturing the same
    1.
    发明授权
    Ink jet head and method of manufacturing the same 有权
    喷墨头及其制造方法

    公开(公告)号：US08398212B2

    公开(公告)日：2013-03-19

    申请号：US12635948

    申请日：2009-12-11

    申请人： Akihiko Okano ,  Masahiko Kubota ,  Ryoji Kanri ,  Atsushi Hiramoto

    发明人： Akihiko Okano ,  Masahiko Kubota ,  Ryoji Kanri ,  Atsushi Hiramoto

    IPC分类号： B41J2/05

    CPC分类号： B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1634

    摘要： An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.

    摘要翻译： 喷墨头包括具有{100}取向的表面的Si衬底; 在Si衬底上保持油墨的通道; 墨水排出口，其连通地连接到通道并通过其喷射墨水; 以及供应端口，其延伸穿过Si衬底，其通信地连接到通道，并且向通道供应墨水。 供应端口具有彼此面对的两个{111}平面的壁。

    Liquid discharge head and method of manufacturing a substrate for the liquid discharge head
    2.
    发明授权
    Liquid discharge head and method of manufacturing a substrate for the liquid discharge head 有权
    液体排出头及液体排出头用基板的制造方法

    公开(公告)号：US08366951B2

    公开(公告)日：2013-02-05

    申请号：US12629238

    申请日：2009-12-02

    申请人： Masafumi Morisue ,  Takumi Suzuki ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Atsushi Hiramoto

    发明人： Masafumi Morisue ,  Takumi Suzuki ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Atsushi Hiramoto

    IPC分类号： G01D15/00

    CPC分类号： B41J2/1404 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1645 ,  B41J2002/14467 ,  Y10T29/494

    摘要： A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from a first surface to a rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a direction of the Si substrate; and forming a plurality of the liquid supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

    摘要翻译： 液体排出头包括：Si基板，其设置有用于产生用于排出液体的能量的元件;以及液体供给口，其被设置成从第一表面到后表面穿过Si基板，以便供应液体 到元素 制造基板的方法包括：在Si基板的后表面上形成多个凹部，其平面取向为{100}，所述凹部面向第一表面并沿着<100> Si衬底; 并且通过使用其中Si衬底的{100}面的蚀刻速率慢于所述Si衬底的蚀刻速率的蚀刻液，通过所述凹部对所述Si衬底进行晶轴各向异性蚀刻来形成多个所述液体供给口 {110}面的Si衬底。

    INK JET HEAD AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    INK JET HEAD AND METHOD OF MANUFACTURING THE SAME 有权
    喷墨头及其制造方法

    公开(公告)号：US20100149260A1

    公开(公告)日：2010-06-17

    申请号：US12635948

    申请日：2009-12-11

    申请人： Akihiko Okano ,  Masahiko Kubota ,  Ryoji Kanri ,  Atsushi Hiramoto

    发明人： Akihiko Okano ,  Masahiko Kubota ,  Ryoji Kanri ,  Atsushi Hiramoto

    IPC分类号： B41J2/135 ,  G11B5/127

    CPC分类号： B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1634

    摘要： An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other.

    摘要翻译： 喷墨头包括具有{100}取向的表面的Si衬底; 在Si衬底上保持油墨的通道; 墨水排出口，其连通地连接到通道并通过其喷射墨水; 以及供应端口，其延伸穿过Si衬底，其通信地连接到通道，并且向通道供应墨水。 供应端口具有彼此面对的两个{111}平面的壁。

    Laser processing method
    4.
    发明授权
    Laser processing method 有权
    激光加工方法

    公开(公告)号：US08829391B2

    公开(公告)日：2014-09-09

    申请号：US12907349

    申请日：2010-10-19

    申请人： Kosuke Kurachi ,  Masahiko Kubota ,  Akihiko Okano ,  Atsushi Hiramoto

    发明人： Kosuke Kurachi ,  Masahiko Kubota ,  Akihiko Okano ,  Atsushi Hiramoto

    IPC分类号： B23K26/42 ,  B23K26/40 ,  B23K26/18 ,  B23K26/36 ,  H01L21/268 ,  B23K26/00

    CPC分类号： B23K26/18 ,  B23K26/361 ,  B23K26/40 ,  B23K26/53 ,  B23K26/60 ,  B23K2103/50 ,  H01L21/268

    摘要： A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.

    摘要翻译： 一种处理被处理物体的激光加工方法。 待处理对象具有修改部分和未修改部分。 改性层形成步骤通过用第一激光的聚光点扫描物体的内部来形成被处理物体的改性层。 改性层（i）的处理速度与第二激光的处理速度相比低于非变形部的处理速度，（ii）形成在非变形部的下方。 去除步骤去除未修饰部分的一部分。 未改性部分的部分从物体的表面到改性层的范围。 去除步骤包括用第二激光照射非改性部分的部分。

    LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE LIQUID DISCHARGE HEAD
    6.
    发明申请
    LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE LIQUID DISCHARGE HEAD 有权
    液体放电头及液体放电头制造方法

    公开(公告)号：US20100156990A1

    公开(公告)日：2010-06-24

    申请号：US12629238

    申请日：2009-12-02

    申请人： Masafumi Morisue ,  Takumi Suzuki ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Atsushi Hiramoto

    发明人： Masafumi Morisue ,  Takumi Suzuki ,  Masahiko Kubota ,  Ryoji Kanri ,  Akihiko Okano ,  Atsushi Hiramoto

    IPC分类号： B41J2/14 ,  B23P17/00

    CPC分类号： B41J2/1404 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639 ,  B41J2/1645 ,  B41J2002/14467 ,  Y10T29/494

    摘要： A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from first surface to rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a direction the first surface; and forming a plurality of the supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate.

    摘要翻译： 液体排出头包括：Si基板，其设置有用于产生用于排出液体的能量的元件和液体供给口，所述液体供给口被设置成从第一表面到后表面穿过Si基板，从而将液体供应到 元件。 一种制造基板的方法包括：在Si基板的背面上形成多个凹部，其中平面取向为{100}，凹面朝向第一表面并且沿着<100>方向排成一列 第一表面 并且通过使用其中Si衬底的{100}面的蚀刻速率比{D“的{100}面的蚀刻速度慢的蚀刻液，通过凹部对Si衬底进行晶轴各向异性蚀刻来形成多个供给口， 110}面。

    LASER PROCESSING METHOD
    7.
    发明申请
    LASER PROCESSING METHOD 有权
    激光加工方法

    公开(公告)号：US20110108532A1

    公开(公告)日：2011-05-12

    申请号：US12907349

    申请日：2010-10-19

    申请人： Kosuke Kurachi ,  Masahiko Kubota ,  Akihiko Okano ,  Atsushi Hiramoto

    发明人： Kosuke Kurachi ,  Masahiko Kubota ,  Akihiko Okano ,  Atsushi Hiramoto

    IPC分类号： B23K26/38

    CPC分类号： B23K26/18 ,  B23K26/361 ,  B23K26/40 ,  B23K26/53 ,  B23K26/60 ,  B23K2103/50 ,  H01L21/268

    摘要： Provided is a laser processing method capable of improving precision of a processing shape and degree of freedom of the processing shape. When a recess portion is formed in a substrate (W) which is an object to be processed, an inner portion of the substrate (W) is scanned with a condensing point (LS1) of modification laser light (L1) which is first laser light to form a modified layer (Wr) which becomes a boundary of a laser processing region (R1) in a position corresponding to a bottom part of the recess portion (modified layer forming step). Next, a surface (Wa) of the substrate (W) is irradiated with condensed processing laser light which is second laser light to remove and process the laser processing region (R1) defined by the modified layer (Wr), to thereby form the recess portion (removing/processing step).

    摘要翻译： 提供了能够提高加工形状的精度和加工形状的自由度的激光加工方法。 当在作为被加工物的基板（W）上形成有凹部时，用作为第一激光的变形激光（L1）的聚光点（LS1）扫描基板（W）的内部， 形成在与凹部（修饰层形成工序）的底部对应的位置成为激光加工区域（R1）的边界的改质层（Wr）。 接下来，用作为第二激光的聚光处理用激光照射基板（W）的表面（Wa），以去除并处理由改性层（Wr）限定的激光加工区域（R1），从而形成凹部 部分（去除/处理步骤）。