A small-sized electronic circuit component comprising micro-wiring and a method for manufacturing the same are provided. The electronic circuit component is manufactured by a manufacturing method comprising the steps of forming a recessed portion which is to be a three-dimensional wiring in the surface of an insulating base material of the electronic circuit component comprising the wiring, forming a first metal layer which is to be an electroplated conductive layer on the surface of the insulating base material including the recessed portion, selectively forming a second metal layer which is to be the wiring only in the recessed portion which is to be the wiring, and removing the first metal layer formed on the surface other than in the recessed portion which is to be the wiring.