发明申请
- 专利标题： ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME
- 专利标题（中）： 电子装置，包括包装基板和通过其形成的电路的电连接器
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申请号： US12696897申请日： 2010-01-29
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公开(公告)号： US20110115069A1公开(公告)日： 2011-05-19
- 发明人: Serene Seoh Hian Teh , Won Yun Sung , Atapol Prajuckamol
- 申请人： Serene Seoh Hian Teh , Won Yun Sung , Atapol Prajuckamol
- 优先权： MYPI20094817 20091113
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/50 ; H01L21/78
摘要：
An electronic device can include a packaging substrate that including an organic material and a hole extending into the packaging substrate. An electrically conductive member can include a via within the hole, and a lead lying along a major surface of the packaging substrate and electrically connected to the via. In an embodiment, the electrically conductive material can be plated, printed, or otherwise formed within and over the organic material, and a leadframe and a corresponding formation of a molding compound around the leadframe are not necessary.
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