公开(公告)号：US20110115069A1

公开(公告)日：2011-05-19

申请号：US12696897

申请日：2010-01-29

申请人： Serene Seoh Hian Teh ,  Won Yun Sung ,  Atapol Prajuckamol

发明人： Serene Seoh Hian Teh ,  Won Yun Sung ,  Atapol Prajuckamol

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L21/78

CPC分类号： H01L24/49 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

摘要： An electronic device can include a packaging substrate that including an organic material and a hole extending into the packaging substrate. An electrically conductive member can include a via within the hole, and a lead lying along a major surface of the packaging substrate and electrically connected to the via. In an embodiment, the electrically conductive material can be plated, printed, or otherwise formed within and over the organic material, and a leadframe and a corresponding formation of a molding compound around the leadframe are not necessary.

摘要翻译： 电子设备可以包括包括有机材料和延伸到包装衬底中的孔的包装衬底。 导电构件可以包括在孔内的通孔，以及沿着封装衬底的主表面并且电连接到通孔的引线。 在一个实施例中，导电材料可以在有机材料内部和外部进行电镀，印刷或以其它方式形成，并且引线框架和引线框架周围的模制化合物的相应形成是不必要的。