公开(公告)号：US20110115069A1

公开(公告)日：2011-05-19

申请号：US12696897

申请日：2010-01-29

申请人： Serene Seoh Hian Teh ,  Won Yun Sung ,  Atapol Prajuckamol

发明人： Serene Seoh Hian Teh ,  Won Yun Sung ,  Atapol Prajuckamol

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L21/78

CPC分类号： H01L24/49 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

摘要： An electronic device can include a packaging substrate that including an organic material and a hole extending into the packaging substrate. An electrically conductive member can include a via within the hole, and a lead lying along a major surface of the packaging substrate and electrically connected to the via. In an embodiment, the electrically conductive material can be plated, printed, or otherwise formed within and over the organic material, and a leadframe and a corresponding formation of a molding compound around the leadframe are not necessary.

摘要翻译： 电子设备可以包括包括有机材料和延伸到包装衬底中的孔的包装衬底。 导电构件可以包括在孔内的通孔，以及沿着封装衬底的主表面并且电连接到通孔的引线。 在一个实施例中，导电材料可以在有机材料内部和外部进行电镀，印刷或以其它方式形成，并且引线框架和引线框架周围的模制化合物的相应形成是不必要的。

公开(公告)号：US20130168866A1

公开(公告)日：2013-07-04

申请号：US13354752

申请日：2012-01-20

申请人： Atapol Prajuckamol ,  Bih Wen Fon ,  Jun Keat Lee

发明人： Atapol Prajuckamol ,  Bih Wen Fon ,  Jun Keat Lee

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/858 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： In one embodiment, a chip-on-lead package structures includes an electronic chip having opposing major surfaces. One major surface of the electronic chip is attached to first and second leads. The one major surface is electrically connected to the first lead, and electrically isolated from the second lead. The other major surface where active device are formed may be electrically connected to the second lead.

摘要翻译： 在一个实施例中，引线封装结构包括具有相对的主表面的电子芯片。 电子芯片的一个主表面附接到第一和第二引线。 一个主表面电连接到第一引线，并与第二引线电隔离。 有源器件形成的另一个主表面可以电连接到第二引线。

公开(公告)号：US08759978B2

公开(公告)日：2014-06-24

申请号：US13354752

申请日：2012-01-20

申请人： Atapol Prajuckamol ,  Bih Wen Fon ,  Jun Keat Lee

发明人： Atapol Prajuckamol ,  Bih Wen Fon ,  Jun Keat Lee

IPC分类号： H01L23/48

CPC分类号： H01L24/85 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49506 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49586 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/858 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： In one embodiment, a chip-on-lead package structures includes an electronic chip having opposing major surfaces. One major surface of the electronic chip is attached to first and second leads. The one major surface is electrically connected to the first lead, and electrically isolated from the second lead. The other major surface where active device are formed may be electrically connected to the second lead.

摘要翻译： 在一个实施例中，引线封装结构包括具有相对主表面的电子芯片。 电子芯片的一个主表面附接到第一和第二引线。 一个主表面电连接到第一引线，并与第二引线电隔离。 有源器件形成的另一个主表面可以电连接到第二引线。

公开(公告)号：US07736951B2

公开(公告)日：2010-06-15

申请号：US11768558

申请日：2007-06-26

申请人： Atapol Prajuckamol ,  Chee Hiong Chew ,  Khiengkrai Khusuwan

发明人： Atapol Prajuckamol ,  Chee Hiong Chew ,  Khiengkrai Khusuwan

IPC分类号： H01L21/00

CPC分类号： H01L23/49548 ,  H01F17/0033 ,  H01F41/046 ,  H01F2027/2814 ,  H01L23/495 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An inductor, a semiconductor component including the inductor, and a method of manufacture. A leadframe has a plurality of conductive strips and a flag. A ferrite core is mounted on a die attach material disposed on the conductive strips and a semiconductor die is mounted on a die attach material disposed on the flag. Wire bonds are formed from the conductive strips on one side of the ferrite core to corresponding conductive strips on an opposing side of the ferrite core. The wire bonds and the conductive strips cooperate to form the coil of the inductor. Wire bonds electrically couple one end of the inductor to leadframe leads adjacent the semiconductor die. Wire bonds couple bond pads on the semiconductor die to the leadframe leads coupled to the inductor. An encapsulant is formed around the inductor and the semiconductor die. Alternatively, a stand-alone inductor is manufactured.

摘要翻译： 电感器，包括电感器的半导体元件及其制造方法。 引线框具有多个导电条和标记。 将铁氧体磁芯安装在设置在导电条上的管芯附着材料上，半导体管芯安装在设置在标记上的管芯附着材料上。 线接合体由铁氧体磁芯的一侧上的导电带形成在铁氧体磁心的相对侧上的相应的导电带上。 引线接合和导电条配合形成电感线圈。 电线将电感器的一端电耦合到与半导体管芯相邻的引线框引线。 引线键将半导体管芯上的接合焊盘耦合到耦合到电感器的引线框引线。 在电感器和半导体管芯周围形成密封剂。 或者，制造独立电感器。

公开(公告)号：US20080224278A1

公开(公告)日：2008-09-18

申请号：US11768558

申请日：2007-06-26

申请人： Atapol Prajuckamol ,  Chee Hiong Chew ,  Khiengkrai Khusuwan

发明人： Atapol Prajuckamol ,  Chee Hiong Chew ,  Khiengkrai Khusuwan

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01F17/0033 ,  H01F41/046 ,  H01F2027/2814 ,  H01L23/495 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An inductor, a semiconductor component including the inductor, and a method of manufacture. A leadframe has a plurality of conductive strips and a flag. A ferrite core is mounted on a die attach material disposed on the conductive strips and a semiconductor die is mounted on a die attach material disposed on the flag. Wire bonds are formed from the conductive strips on one side of the ferrite core to corresponding conductive strips on an opposing side of the ferrite core. The wire bonds and the conductive strips cooperate to form the coil of the inductor. Wire bonds electrically couple one end of the inductor to leadframe leads adjacent the semiconductor die. Wire bonds couple bond pads on the semiconductor die to the leadframe leads coupled to the inductor. An encapsulant is formed around the inductor and the semiconductor die. Alternatively, a stand-alone inductor is manufactured.

摘要翻译： 电感器，包括电感器的半导体元件及其制造方法。 引线框具有多个导电条和标记。 将铁氧体磁芯安装在设置在导电条上的管芯附着材料上，半导体管芯安装在设置在标记上的管芯附着材料上。 线接合体由铁氧体磁芯的一侧上的导电带形成在铁氧体磁心的相对侧上的相应的导电带上。 引线接合和导电条配合形成电感线圈。 电线将电感器的一端电耦合到与半导体管芯相邻的引线框引线。 引线键将半导体管芯上的接合焊盘耦合到耦合到电感器的引线框引线。 在电感器和半导体管芯周围形成密封剂。 或者，制造独立电感器。