发明申请
US20110116246A1 PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF
审中-公开
具有电子元件的印刷电路板及其制造方法
- 专利标题: PRINTED CIRCUIT BOARD HAVING ELECTRO-COMPONENT AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 具有电子元件的印刷电路板及其制造方法
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申请号: US12818497申请日: 2010-06-18
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公开(公告)号: US20110116246A1公开(公告)日: 2011-05-19
- 发明人: Jin-Won LEE , Yul-Kyo Chung , Seung-Hyun Sohn , Moon-Il Kim
- 申请人: Jin-Won LEE , Yul-Kyo Chung , Seung-Hyun Sohn , Moon-Il Kim
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2009-0110960 20091117
- 主分类号: H05K1/18
- IPC分类号: H05K1/18 ; B32B37/02
摘要:
An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate.