公开(公告)号：US20110116246A1

公开(公告)日：2011-05-19

申请号：US12818497

申请日：2010-06-18

申请人： Jin-Won LEE ,  Yul-Kyo Chung ,  Seung-Hyun Sohn ,  Moon-Il Kim

发明人： Jin-Won LEE ,  Yul-Kyo Chung ,  Seung-Hyun Sohn ,  Moon-Il Kim

IPC分类号： H05K1/18 ,  B32B37/02

CPC分类号： H05K1/18 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H05K3/30 ,  H05K3/46 ,  Y10T29/49146 ,  Y10T156/10

摘要： An electronic component embedded printed circuit board and a method of manufacturing the same are disclosed. The electronic component embedded printed circuit board in accordance with an embodiment of the present invention can include a first substrate, which has a cavity formed therein, a first electronic component, which is embedded in the cavity in a face-down manner, a second electronic component, which is stacked on an upper side of the first electronic component and embedded in the cavity in a face-up manner, and a second substrate, which is stacked on upper and lower surfaces of the first substrate.

摘要翻译： 公开了电子部件嵌入式印刷电路板及其制造方法。 根据本发明的实施例的电子部件嵌入式印刷电路板可以包括：第一基板，其具有形成在其中的空腔;第一电子部件，以面朝下的方式嵌入在所述空腔中;第二电子部件 所述第一基板被堆叠在所述第一电子部件的上侧并以面朝上的方式嵌入所述空腔中;以及第二基板，其被堆叠在所述第一基板的上表面和下表面上。

公开(公告)号：US20070132536A1

公开(公告)日：2007-06-14

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H01F5/00

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20060189351A1

公开(公告)日：2006-08-24

申请号：US11156152

申请日：2005-06-17

申请人： Seong-Taek Hwang ,  Jae-Hoon Lee ,  Moon-Il Kim ,  Ji-Chai Jeong ,  Jong-Kuck Son

发明人： Seong-Taek Hwang ,  Jae-Hoon Lee ,  Moon-Il Kim ,  Ji-Chai Jeong ,  Jong-Kuck Son

IPC分类号： H04B1/38 ,  H04M1/00

CPC分类号： H01P1/127 ,  H01P1/15

摘要： A radio frequency switch is disclosed. The switch includes a plurality of first substrates in which a ground surface is formed on each of the first substrates and a micro-strip line and a semiconductor on/off switch are disposed on a plane surface of the ground surface, a plurality of second substrates in which a ground surface is formed on each of the second substrates and a micro-strip line is disposed on a plan surface of the ground surface, the second substrates being combined with the first substrates so as to cross each other and being electrically connected to the first substrates, and combining means for combining the first and second substrates so as to cross each other.

摘要翻译： 公开了射频开关。 开关包括多个第一基板，其中在每个第一基板上形成接地表面，并且微带线和半导体开/关开关设置在地表面的平面上，多个第二基板 其中在所述第二基板的每一个上形成接地表面，并且在所述接地表面的平面表面上设置微带线，所述第二基板与所述第一基板结合以彼此交叉并且电连接到 第一基板和用于组合第一和第二基板以便彼此交叉的组合装置。

公开(公告)号：US08011086B2

公开(公告)日：2011-09-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/36 ,  H05K3/02 ,  H01R9/00

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US20080052906A1

公开(公告)日：2008-03-06

申请号：US11896105

申请日：2007-08-29

申请人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

发明人： Doo-Hwan Lee ,  Seung-Gu Kim ,  Won-Cheol Bae ,  Moon-Il Kim ,  Jae-Kul Lee

IPC分类号： H05K3/02

CPC分类号： H01L24/11 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0376 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49153 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. By using a method of manufacturing a component-embedded printed circuit board, which includes: mounting a component on a first copper foil, on which a pattern is formed, such that the component is electrically connected with the pattern; stacking an insulation layer, which has a cavity formed in a position corresponding to the component, on a second copper foil, on which at least one conductive protrusion is formed; stacking together the first copper foil and the second copper foil such that the component is embedded in the cavity and the first copper foil and the second copper foil are electrically connected by the conductive protrusion; and removing portions of the first copper foil and the second copper foil to form circuit patterns, the circuit pattern formed from the first copper foil may be given a buried form, so that it is possible to manufacture a thin printed circuit board, when embedding a flip chip type component.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 通过使用组件嵌入式印刷电路板的制造方法，该方法包括：将组件安装在其上形成图案的第一铜箔上，使得该部件与图案电连接; 在其上形成有至少一个导电突起的第二铜箔上堆叠具有形成在与所述部件相对应的位置的空腔的绝缘层; 将第一铜箔和第二铜箔堆叠在一起，使得该部件嵌入到空腔中，并且第一铜箔和第二铜箔通过导电突起电连接; 并且去除第一铜箔和第二铜箔的部分以形成电路图案，由第一铜箔形成的电路图案可以被埋置形式，使得可以制造薄的印刷电路板，当嵌入 倒装芯片类型组件。

公开(公告)号：US07947906B2

公开(公告)日：2011-05-24

申请号：US11528322

申请日：2006-09-28

申请人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Je-Gwang Yoo ,  Seung-Gu Kim ,  Jae-Kul Lee ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K3/02 ,  H05K1/00

CPC分类号： H05K1/185 ,  H01L23/13 ,  H01L23/142 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/053 ,  H05K3/4608 ,  H05K2201/09745 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/49156 ,  H01L2924/00

摘要： A multi-layer printed circuit board and a method of manufacturing the multi-layer printed circuit board using a metal substrate as a core member and having an electronic component embedded in the metal substrate, the method including anodizing the metal substrate such that an anodic oxide layer is formed on upper and lower sides of the metal substrate, respectively; forming an inner layer circuit on upper and lower anodic oxide layers, respectively; etching the metal substrate to form a cavity in correspondence with a position where the electronic component is to be embedded; mounting the electronic component in the cavity with a chip bond adhesive; and forming an outer layer circuit on upper and lower sides of the metal substrate, respectively, such that a multi-layer circuit is formed.

摘要翻译： 一种多层印刷电路板和使用金属基板作为核心部件并且具有嵌入在金属基板中的电子部件的多层印刷电路板的制造方法，该方法包括阳极氧化金属基板以使阳极氧化物 层分别形成在金属基板的上侧和下侧; 分别在上下阳极氧化层上形成内层电路; 蚀刻金属基板以形成与要嵌入电子部件的位置相对应的空腔; 用芯片粘合剂将电子部件安装在腔体中; 并且在金属基板的上侧和下侧分别形成外层电路，使得形成多层电路。

公开(公告)号：US20100242272A1

公开(公告)日：2010-09-30

申请号：US12801337

申请日：2010-06-03

申请人： Moon-Il Kim ,  Young-Do Kweon

发明人： Moon-Il Kim ,  Young-Do Kweon

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/18162 ,  H05K2201/0367 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83005

摘要： A method of manufacturing a printed circuit board (PCB) having embedded components. The method includes: forming a cavity in one side of a dielectric substrate; inserting a first component in the cavity such that an electrode thereof faces the one side of the dielectric substrate; mounting a second component on one side of the first component such that an electrode thereof faces the same direction as the electrode of the first component; forming a first dielectric layer on one side of the dielectric substrate such that the first dielectric layer covers the second component; and forming a second dielectric layer on the other side of the dielectric substrate such that the second dielectric layer covers the first component.

摘要翻译： 一种制造具有嵌入元件的印刷电路板（PCB）的方法。 该方法包括：在电介质基板的一侧形成空腔; 将第一部件插入所述腔中使得其电极面对​​所述电介质基板的所述一侧; 在所述第一部件的一侧安装第二部件，使得其电极面向与所述第一部件的电极相同的方向; 在所述电介质基板的一侧上形成第一介电层，使得所述第一介电层覆盖所述第二部件; 以及在所述电介质基板的另一侧上形成第二电介质层，使得所述第二电介质层覆盖所述第一部件。

公开(公告)号：US07697301B2

公开(公告)日：2010-04-13

申请号：US11637664

申请日：2006-12-13

申请人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

发明人： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

摘要翻译： 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20090071705A1

公开(公告)日：2009-03-19

申请号：US12007688

申请日：2008-01-14

申请人： Moon-Il Kim ,  Young-Do Kweon

发明人： Moon-Il Kim ,  Young-Do Kweon

IPC分类号： H01R12/06 ,  H05K3/42

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/18162 ,  H05K2201/0367 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/83005

摘要： A PCB (printed circuit board) having embedded components and a method for manufacturing thereof are disclosed. The PCB may include a dielectric substrate having a cavity formed in one side, a first component inserted in the cavity such that an electrode of the first component faces the one side of the dielectric substrate, a second component mounted on one side of the first component such that an electrode of the second component faces the same direction as the electrode of the first component, a first dielectric layer formed on one side of the dielectric substrate such that the first dielectric layer covers the second component, and a second dielectric layer formed on the other side of the dielectric substrate such that the second dielectric layer covers the first component. In this PCB, multiple components of differing thickness can be mounted, and vias can be formed more easily.

摘要翻译： 公开了具有嵌入部件的PCB（印刷电路板）及其制造方法。 PCB可以包括具有在一侧形成的空腔的电介质基板，插入空腔中的第一部件，使得第一部件的电极面向电介质基板的一侧，第二部件安装在第一部件的一侧 使得第二部件的电极面向与第一部件的电极相同的方向，形成在电介质基板的一侧上的第一电介质层，使得第一电介质层覆盖第二部件，第二电介质层形成在 电介质基板的另一侧使得第二介电层覆盖第一部件。 在该PCB中，可以安装不同厚度的多个部件，并且可以更容易地形成通孔。

公开(公告)号：US20080115349A1

公开(公告)日：2008-05-22

申请号：US11984210

申请日：2007-11-14

申请人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Doo-Hwan Lee ,  Moon-Il Kim

发明人： Seung-Gu Kim ,  Je-Gwang Yoo ,  Doo-Hwan Lee ,  Moon-Il Kim

IPC分类号： H05K3/30 ,  H05K3/36 ,  H05K3/20

CPC分类号： H05K1/185 ,  H01L21/52 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68309 ,  H01L2224/24227 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/14 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2203/0156 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

摘要： A method of manufacturing a component-embedded printed circuit board component is disclosed. With a method of manufacturing a component-embedded printed circuit board that includes: perforating a through-hole in a core substrate, on a surface of which a circuit pattern is formed, attaching tape to one side of the core substrate and attaching a component onto the tape exposed in the through-hole, filling adhesive in a portion of the gap between the through-hole and the component to secure the component, removing the tape, and collectively stacking insulation on both sides of the core substrate to fill the remainder of the gap between the through-hole and the component with portions of the insulation, the component may be embedded using a minimal amount of heterogeneous materials, so that the warpage of the board may be prevented

摘要翻译： 公开了一种制造组件嵌入式印刷电路板部件的方法。 通过制造嵌入元件的印刷电路板的方法，该方法包括：对芯基板中的通孔进行穿孔，在其表面上形成电路图案，将带附着到芯基板的一侧并将元件附着到 胶带暴露在通孔中，将粘合剂填充在通孔和部件之间的间隙的一部分中以固定部件，去除胶带，并且在芯基板的两侧上共同堆叠绝缘体以填充其余部分 通孔和部件之间的间隙与部分绝缘体相同，部件可以使用极少量的异质材料进行嵌入，从而可以防止板的翘曲