发明申请
- 专利标题: LIGHT EMITTING MODULE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 发光模块及其制造方法
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申请号: US12674564申请日: 2008-08-28
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公开(公告)号: US20110121335A1公开(公告)日: 2011-05-26
- 发明人: Sadamichi Takakusaki , Tatsuya Motoike , Akihisa Matsumoto
- 申请人: Sadamichi Takakusaki , Tatsuya Motoike , Akihisa Matsumoto
- 申请人地址: JP Moriguchi-shi JP Gunma JP Tottori-shi
- 专利权人: SANYO Electric Co., Inc.,SANYO Semiconductor Co., Ltd.,SANYO Consumer Electronics Co., Ltd.
- 当前专利权人: SANYO Electric Co., Inc.,SANYO Semiconductor Co., Ltd.,SANYO Consumer Electronics Co., Ltd.
- 当前专利权人地址: JP Moriguchi-shi JP Gunma JP Tottori-shi
- 优先权: JP2007-225567 20070831
- 国际申请: PCT/JP2008/066130 WO 20080828
- 主分类号: H01L33/60
- IPC分类号: H01L33/60 ; H01L33/48
摘要:
Provided are a light emitting module and a manufacturing method thereof, the light emitting module having improved heat radiation properties and improved adhesion between a sealing resin for sealing a light emitting element and other members. A light emitting module 10 includes: a metal substrate 12; a concave part 18 provided by partially denting an upper surface of the metal substrate 12; a light emitting element 20 accommodated in the concave part 18; and a sealing resin 32 covering the light emitting element 20. A convex part 11 is further provided on the upper surface of the metal substrate 40 in a region thereof surrounding the concave part 18. The sealing resin 32 is allowed to adhere to the convex part 11, thereby improving adhesion strength between the sealing resin 32 and the metal substrate 12.
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