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公开(公告)号：US07936569B2
公开(公告)日：2011-05-03
申请号：US11307283
申请日：2006-01-30
IPC分类号： H05K7/00
CPC分类号： H05K3/341 , H01L24/83 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/15787 , H01L2924/19105 , H01L2924/30107 , H05K3/243 , H05K3/244 , H05K3/284 , H05K3/3463 , H05K2201/0391 , H05K2201/10969 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
摘要翻译： 在作为本发明的电路装置的混合集成电路装置中，在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器，所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中，在第一焊盘的表面上形成由镍制成的镀膜。 因此，第一焊盘和焊料不会彼此接触。 因此，不会产生焊接性差的Cu / Sn合金层，而是产生焊接性优异的Ni / Sn合金层。 因此，抑制熔融焊料中的沉陷的发生。
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公开(公告)号：US20090129038A1
公开(公告)日：2009-05-21
申请号：US12065001
申请日：2006-08-30
CPC分类号： H01L23/49861 , H01L23/3672 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/0203 , H05K1/056 , H05K3/284 , H05K2201/1034 , H05K2201/1053 , H05K2201/10969 , Y10T29/49139 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation.
摘要翻译： 提供了其中并入产生大量热量的功率元件的电路装置的简化结构。 根据本发明的电路装置包括：表面被绝缘层覆盖的电路板; 形成在所述绝缘层的表面上的导电图案; 电连接到所述导电图案的电路元件; 以及连接到由导电图案形成的焊盘的引线。 此外，功率元件固定到由引线的一部分形成的接地部的顶表面。 因此，陆部用作散热器，从而有助于散热。
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公开(公告)号：US20070205017A1
公开(公告)日：2007-09-06
申请号：US11307283
申请日：2006-01-30
CPC分类号： H05K3/341 , H01L24/83 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83 , H01L2924/01322 , H01L2924/01327 , H01L2924/14 , H01L2924/15787 , H01L2924/19105 , H01L2924/30107 , H05K3/243 , H05K3/244 , H05K3/284 , H05K3/3463 , H05K2201/0391 , H05K2201/10969 , Y02P70/613 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.
摘要翻译： 在作为本发明的电路装置的混合集成电路装置中，在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器，所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中，在第一焊盘的表面上形成由镍制成的镀膜。 因此，第一焊盘和焊料不会彼此接触。 因此，不会产生焊接性差的Cu / Sn合金层，而是产生焊接性优异的Ni / Sn合金层。 因此，抑制熔融焊料中的沉陷的发生。
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公开(公告)号：US07250352B2
公开(公告)日：2007-07-31
申请号：US10421921
申请日：2003-04-24
IPC分类号： H01L21/46
CPC分类号： H05K3/0052 , H01L2924/01023 , H01L2924/14 , H01L2924/19105 , H05K1/056 , H05K3/284 , H05K2201/09036 , H05K2201/0909 , H05K2201/09745 , H05K2203/0228 , H05K2203/1572 , H05K2203/302
摘要： In preferred embodiments, a method of manufacturing a hybrid integrated circuit device is provided, in which a plurality of circuit substrates 10 are manufactured from a single metal substrate 10A′ by dicing. In some embodiments, the method includes: preparing a metal substrate 10A′ having an insulating layer 11 formed on the top surface thereof; forming a plurality of conductive patterns 12 on the top surface of insulating layer 11; forming grooves 20 in lattice form on the rear surface of metal substrate 10B′; mounting hybrid integrated circuits onto conductive patterns 12; and separating individual circuit substrates 10 with, for example, a rotatable cutter.
摘要翻译： 在优选实施例中，提供了一种制造混合集成电路器件的方法，其中通过切割由单个金属衬底10A'制造多个电路衬底10。 在一些实施例中，该方法包括：制备具有形成在其顶表面上的绝缘层11的金属基底10A' 在绝缘层11的顶表面上形成多个导电图案12; 在金属基板10B'的后表面上形成格子状的槽20; 将混合集成电路安装到导电图案12上; 并且用例如可旋转切割器分离各个电路基板10。
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公开(公告)号：US20060024862A1
公开(公告)日：2006-02-02
申请号：US11179431
申请日：2005-07-11
IPC分类号： H01L21/50
CPC分类号： H05K3/4647 , H01L21/4857 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L2221/68345 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85001 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K1/0265 , H05K1/185 , H05K1/187 , H05K3/06 , H05K3/20 , H05K3/423 , H05K3/4652 , H05K3/4658 , H05K3/4682 , H05K2201/0209 , H05K2201/09509 , H05K2201/09563 , H05K2201/09736 , H05K2203/0152 , H05K2203/0369 , H05K2203/1476 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented. Hence, it becomes possible to prevent flaking of conductive patterns from the substrate and a poor contact between the conductive patterns and a metal thin wire, and consequently to manufacture a highly reliable circuit device.
摘要翻译： 提供一种制造高可靠性电路装置的方法，其实现更小，更薄和更轻的构造。 在根据本发明的电路装置的制造方法中，在支撑基板的顶表面上形成包含电路装置的树脂密封体之后，树脂密封体与支撑基板分离。 因此，可以制造没有基板的电路装置，并且实现了具有改善的散热的更薄更轻的电路装置。 此外，由于可以在支撑基板上进行密封树脂的密封，所以可以防止由密封树脂和导电图案之间以及密封树脂和电路部件之间的热膨胀系数的差异引起的翘曲。 因此，可以防止导电图案从基板剥落，并且导电图案与金属细线之间的接触不良，从而制造高可靠性的电路装置。
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公开(公告)号：US20050263482A1
公开(公告)日：2005-12-01
申请号：US11139142
申请日：2005-05-27
IPC分类号： H05K3/34 , B44C1/22 , H01B13/00 , H01L21/28 , H01L21/48 , H01L21/98 , H01L23/12 , H05K1/02 , H05K1/05 , H05K3/00 , H05K3/28 , H05K3/40
CPC分类号： H01L25/50 , H01L21/4821 , H01L21/4871 , H01L24/97 , H01L2221/68377 , H01L2224/48091 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K1/056 , H05K3/28 , H05K3/284 , H05K3/4007 , H05K2203/0369 , H05K2203/1476 , H01L2924/00014 , H01L2224/92247 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： In a method of manufacturing a circuit device of the present invention, protruding portions protruding upward are formed in part of a conductive pattern formed on the front surface of a circuit substrate. Next, the front surface of the circuit substrate including the protruding portions is coated with coating resin. Subsequently, the coating resin is etched so that the top surfaces of the protruding portions are exposed. Then, the fixation and electrical connection of circuit elements are performed. Finally, an electric circuit formed on the front surface is sealed, whereby a hybrid integrated circuit device is completed.
摘要翻译： 在制造本发明的电路装置的方法中，向上突出的突出部分形成在形成在电路基板的前表面上的导电图案的一部分中。 接下来，包括突出部分的电路基板的前表面涂覆有涂覆树脂。 接着，对涂布树脂进行蚀刻，使突出部的顶面露出。 然后，执行电路元件的固定和电连接。 最后，密封形成在前表面上的电路，从而完成混合集成电路装置。
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公开(公告)号：US08203848B2
公开(公告)日：2012-06-19
申请号：US12065001
申请日：2006-08-30
IPC分类号： H01R9/00
CPC分类号： H01L23/49861 , H01L23/3672 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2924/00014 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/0203 , H05K1/056 , H05K3/284 , H05K2201/1034 , H05K2201/1053 , H05K2201/10969 , Y10T29/49139 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation.
摘要翻译： 提供了其中并入产生大量热量的功率元件的电路装置的简化结构。 根据本发明的电路装置包括：表面被绝缘层覆盖的电路板; 形成在所述绝缘层的表面上的导电图案; 电连接到所述导电图案的电路元件; 以及连接到由导电图案形成的焊盘的引线。 此外，功率元件固定到由引线的一部分形成的接地部的顶表面。 因此，陆部用作散热器，从而有助于散热。
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8.发明申请CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND CONDUCTIVE FOIL PROVIDED WITH INSULATING LAYER 审中-公开电路板及其制造方法，电路装置及其制造方法，以及提供绝缘层的导电箔公开(公告)号：US20120018201A1
公开(公告)日：2012-01-26
申请号：US13184078
申请日：2011-07-15
申请人： Sadamichi TAKAKUSAKI
发明人： Sadamichi TAKAKUSAKI
CPC分类号： H01L23/3733 , H01L21/481 , H01L23/142 , H01L23/145 , H01L23/3107 , H01L23/3735 , H01L24/48 , H01L24/73 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/12041 , H01L2924/1304 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10T29/49124 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a circuit board easy to process by laser and a manufacturing method thereof A circuit board of the present invention includes a substrate, an insulating layer covering an upper surface of the substrate, and a conductive pattern of a predetermined shape formed on an upper surface of the insulating layer. The insulating layer is made of a resin material highly filled with a filler made of silica. Further, a colorant made of an inorganic material is added to the resin material. Accordingly, when a laser is radiated onto the insulating layer in order to perform cutting and removing processing, the insulating layer is removed because the laser is absorbed by the colored resin material.
摘要翻译： 提供一种易于通过激光加工的电路板及其制造方法本发明的电路板包括基板，覆盖基板的上表面的绝缘层和形成在上表面上的预定形状的导电图案 的绝缘层。 绝缘层由高度填充有由二氧化硅制成的填料的树脂材料制成。 此外，将由无机材料制成的着色剂加入到树脂材料中。 因此，当激光被照射到绝缘层上以进行切割和去除处理时，由于激光被着色树脂材料吸收，绝缘层被去除。
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公开(公告)号：US07221049B2
公开(公告)日：2007-05-22
申请号：US11139263
申请日：2005-05-27
IPC分类号： H01I23/12
CPC分类号： H01L23/5383 , H01L21/4857 , H01L21/4871 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/4903 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H05K1/0206 , H05K1/056 , H05K3/0061 , H05K3/284 , H05K3/4652 , H05K3/4688 , H05K2201/0209 , H05K2201/0266 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A circuit device having a multilayered wiring structure and an excellent heat dissipation property, and a method of manufacturing the circuit device are provided. In a circuit device, a multilayered wiring structure including a first conductive pattern and a second conductive pattern is formed on a surface of a circuit substrate. A first insulating layer is formed entirely on the surface of the circuit substrate. The first conductive pattern and the second conductive pattern are mutually insulated by a second insulating layer. An amount and grain sizes of filler included in the second insulating layer are smaller than an amount and grain sizes of filler included in the first insulating layer. Therefore, it is easier to connect the above two conductive patterns by way of penetrating the second insulating layer.
摘要翻译： 具有多层布线结构和散热性优异的电路装置以及制造该电路装置的方法。 在电路装置中，在电路基板的表面上形成包括第一导电图案和第二导电图案的多层布线结构。 第一绝缘层整体形成在电路基板的表面上。 第一导电图案和第二导电图案由第二绝缘层相互绝缘。 包含在第二绝缘层中的填料的量和晶粒尺寸小于包含在第一绝缘层中的填料的量和晶粒尺寸。 因此，通过穿透第二绝缘层更容易连接上述两个导电图案。
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公开(公告)号：US07186921B2
公开(公告)日：2007-03-06
申请号：US11141519
申请日：2005-05-31
IPC分类号： H05K1/03
CPC分类号： H05K1/0265 , H01L23/538 , H01L23/5383 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/13055 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H05K1/0203 , H05K1/0206 , H05K1/056 , H05K3/284 , H05K3/4647 , H05K3/4652 , H05K2201/0355 , H05K2201/09736 , H05K2201/10969 , H05K2203/0369 , H05K2203/049 , H05K2203/1189 , H05K2203/1476 , Y10T29/49155 , H01L2924/00 , H01L2924/00012 , H01L2924/20758 , H01L2924/00015 , H01L2224/05599
摘要： A circuit device which enables formation of a minute pattern while securing a current capacity and has excellent heat release properties, and a manufacturing method thereof are provided. In a circuit device of the present invention, among multiple wiring layers, a first wiring layer is formed of a thin first conductive pattern and a thick second conductive pattern. Therefore, formation of the minute patterns is realized while securing the current capacity. Moreover, a small-signal circuit element is mounted on the first conductive pattern, and a large-current circuit element is mounted on the second conductive pattern. Thus, circuit elements having different sizes of currents to be handled are mounted on the same board. Furthermore, heat release properties are improved by the second conductive pattern which is formed to be thick.
摘要翻译： 提供能够形成微小图案同时确保电流容量并具有优异的散热特性的电路装置及其制造方法。 在本发明的电路装置中，在多个布线层之中，第一布线层由薄的第一导电图案和厚的第二导电图案形成。 因此，在确保电流容量的同时实现微小图案的形成。 此外，小信号电路元件安装在第一导电图案上，并且大电流电路元件安装在第二导电图案上。 因此，具有不同尺寸的待处理电流的电路元件安装在同一板上。 此外，通过形成为厚的第二导电图案来改善散热性能。
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