Invention Application
- Patent Title: SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMICONDUCTOR MODULE INCLUDING THE SOLDER STRUCTURE
- Patent Title (中): 焊接结构，形成焊接结构的方法和包括焊接结构的半导体模块
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Application No.: US12935864Application Date: 2009-03-18
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Publication No.: US20110127669A1Publication Date: 2011-06-02
- Inventor: Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
- Applicant: Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
- Priority: JP2008-092111 20080331
- International Application: PCT/JP2009/055318 WO 20090318
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/48 ; H01B5/02 ; B23K1/20
Abstract:
The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm.
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Information query
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