公开(公告)号：US08278566B2

公开(公告)日：2012-10-02

申请号：US12364084

申请日：2009-02-02

Applicant: Hajime Kobayashi ,  Yasuyuki Yanase ,  Tetsuya Yamamoto ,  Yoshio Okayama

Inventor： Hajime Kobayashi ,  Yasuyuki Yanase ,  Tetsuya Yamamoto ,  Yoshio Okayama

IPC: H05K1/11

Abstract: A device mounting board includes: an insulating resin layer; a wiring layer disposed on one main surface of the insulating resin layer; and a bump electrode connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A side surface of the bump electrode is curved inwardly toward the center axis of the bump electrode as viewed in a cross section including the center axis of the bump electrode, and the radius of curvature of the side surface changes continuously from a wiring layer end to a head end of the bump electrode.

公开(公告)号：US07341819B2

公开(公告)日：2008-03-11

申请号：US11189630

申请日：2005-07-25

Applicant: Katsunori Goi ,  Narito Goto ,  Tetsuo Shima ,  Hajime Kobayashi ,  Nobuaki Tsuji

Inventor： Katsunori Goi ,  Narito Goto ,  Tetsuo Shima ,  Hajime Kobayashi ,  Nobuaki Tsuji

IPC: G03C1/00

CPC classification number: G03C3/00

Abstract: Several sheets of sheet-shaped photosensitive material 1 are stacked on a paper tray container 2 prepared by press-forming stencil paper sheet, the photosensitive material 1 stacked on said paper tray container is inserted into a moisture-proof and light-shielding bag 3 made of a photosensitive material packaging material having moisture-proof and light-shielding properties and having an aluminum thin foil layer, and the moisture-proof and light-shielding bag 3 is sealed tight under a reduced pressure vacuum.

Abstract translation: 将几张片状感光材料1堆叠在通过压制成形的模版纸制成的纸盘容器2上，将堆叠在所述纸盘容器上的感光材料1插入到防潮和遮光袋3中 具有防潮和遮光性能并且具有铝薄箔层的感光材料包装材料，并且在减压真空下密封防潮和遮光袋3。

公开(公告)号：US5646916A

公开(公告)日：1997-07-08

申请号：US531223

申请日：1995-09-19

Applicant: Hajime Kobayashi

Inventor： Hajime Kobayashi

IPC: G11B7/085 ,  G11B7/095 ,  G11B7/00

CPC classification number: G11B7/08517 ,  G11B7/08529 ,  G11B7/0953

Abstract: A photosensor receives laser light reflected from an optical disk with a two-segmented photodetecting surface. A relative speed detecting section binarizes a difference signal of output signals of the photosensor, and detects time points when the laser light is located at the centers of tracks and grooves of the optical disk. When a detected interval is longer than a preset value, the relative speed detecting section outputs a speed detection pulse having a preset pulse width. A track detecting section binarizes a sum signal of the output signals of the photosensor, detects time points when the laser light is located at a track edge, and outputs a track detection pulse having a preset pulse width. A loop switch turns on/off a tracking servo loop in accordance with a tracking start signal that is generated by an AND circuit and a D flip-flop.

Abstract translation: 光传感器接收由具有两段光电检测面的光盘反射的激光。 相对速度检测部将光传感器的输出信号的差分信号二值化，并且检测当激光位于光盘的轨道和凹槽的中心处的时间点。 当检测到的间隔大于预设值时，相对速度检测部分输出具有预设脉冲宽度的速度检测脉冲。 磁道检测部将光传感器的输出信号的和信号二值化，检测激光位于磁道边缘的时间点，并输出具有预设脉冲宽度的磁道检测脉冲。 根据由AND电路和D触发器产生的跟踪开始信号，环路开关接通/关闭跟踪伺服环路。

公开(公告)号：US4243994A

公开(公告)日：1981-01-06

申请号：US16985

申请日：1979-03-02

Applicant: Hajime Kobayashi ,  Noboru Koumura ,  Shigeru Ohno

Inventor： Hajime Kobayashi ,  Noboru Koumura ,  Shigeru Ohno

IPC: B41J2/01 ,  B41M5/00 ,  C09D11/00 ,  G01D15/18

CPC classification number: C09D11/30

Abstract: A liquid recording medium for recording by ejecting liquid droplets comprises (a) recording agent which is a component to form a recorded image; and (b) carrier liquid to dissolve or disperse said recording agent, a difference .DELTA.T between a decomposition temperature of a substance having the lowest decomposition temperature among the substances constituting the recording agent and a boiling point of said liquid recording medium, exclusive of said recording agent, being at least 30.degree. C.

Abstract translation: 通过喷射液滴进行记录的液体记录介质包括：（a）记录剂，其是用于形成记录图像的组分; 和（b）用于溶解或分散所述记录剂的载体液体，构成记录剂的物质的分解温度最低的物质的分解温度与所述液体记录介质的沸点之间的差ΔTA，不包括所述 记录剂，至少30℃

公开(公告)号：US08373281B2

公开(公告)日：2013-02-12

申请号：US13056851

申请日：2009-07-29

Applicant: Hajime Kobayashi ,  Mayumi Nakasato ,  Ryosuke Usui ,  Yasuyuki Yanase ,  Koichi Saito

Inventor： Hajime Kobayashi ,  Mayumi Nakasato ,  Ryosuke Usui ,  Yasuyuki Yanase ,  Koichi Saito

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49541 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/16 ,  H01L24/19 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.

Abstract translation: 安装在形成在布线层上的绝缘树脂层上的半导体元件被密封树脂​​密封。 在布线层上，分别与布线层一体地形成突出于半导体元件侧的突出电极和突出部。 突出电极通过穿透绝缘树脂层与半导体元件的元件电极电连接。 突出部被布置成围绕半导体元件的四个边缘包围半导体元件，并且嵌入到密封树脂中直到突出电极和元件电极接合的部分上方。

公开(公告)号：US08309864B2

公开(公告)日：2012-11-13

申请号：US12364084

申请日：2009-02-02

Applicant: Hajime Kobayashi ,  Yasuyuki Yanase ,  Tetsuya Yamamoto ,  Yoshio Okayama

Inventor： Hajime Kobayashi ,  Yasuyuki Yanase ,  Tetsuya Yamamoto ,  Yoshio Okayama

IPC: H05K1/11

CPC classification number: H01L23/49816 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/06 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02351 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/06051 ,  H01L2224/061 ,  H01L2224/13022 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device mounting board includes: an insulating resin layer; a wiring layer disposed on one main surface of the insulating resin layer; and a bump electrode connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A side surface of the bump electrode is curved inwardly toward the center axis of the bump electrode as viewed in a cross section including the center axis of the bump electrode, and the radius of curvature of the side surface changes continuously from a wiring layer end to a head end of the bump electrode.

Abstract translation: 装置安装板包括：绝缘树脂层; 布置在所述绝缘树脂层的一个主表面上的布线层; 以及与布线层电连接并且在绝缘树脂层的与布线层一侧突出的突起电极。 凸起电极的侧表面在包括突起电极的中心轴的横截面中观察时朝向突起电极的中心轴线弯曲，并且侧表面的曲率半径从布线层端部连续变化到 凸起电极的头端。

公开(公告)号：US20110186993A1

公开(公告)日：2011-08-04

申请号：US13056851

申请日：2009-07-29

Applicant: Hajime Kobayashi ,  Mayumi Nakasato ,  Ryosuke Usui ,  Yasuyuki Yanase ,  Koichi Saito

Inventor： Hajime Kobayashi ,  Mayumi Nakasato ,  Ryosuke Usui ,  Yasuyuki Yanase ,  Koichi Saito

IPC: H01L23/485

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49541 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/16 ,  H01L24/19 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.

Abstract translation: 安装在形成在布线层上的绝缘树脂层上的半导体元件被密封树脂​​密封。 在布线层上，分别与布线层一体地形成突出于半导体元件侧的突出电极和突出部。 突出电极通过穿透绝缘树脂层与半导体元件的元件电极电连接。 突出部被布置成围绕半导体元件的四个边缘包围半导体元件，并且嵌入到密封树脂中直到突出电极和元件电极接合的部分上方。

公开(公告)号：US20110127669A1

公开(公告)日：2011-06-02

申请号：US12935864

申请日：2009-03-18

Applicant: Hideki Mizuhara ,  Hajime Kobayashi ,  Toshiya Shimizu

Inventor： Hideki Mizuhara ,  Hajime Kobayashi ,  Toshiya Shimizu

IPC: H01L23/498 ,  H01L23/48 ,  H01B5/02 ,  B23K1/20

CPC classification number: B23K1/0016 ,  B23K31/02 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/42 ,  B32B15/018 ,  C22C13/00 ,  C22C13/02 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3463 ,  H05K2203/0435 ,  H01L2924/00

Abstract: The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm.

Abstract translation: 本发明提供一种不太可能开发Sn晶须的焊料结构和形成这种焊料结构的方法。 焊料结构包括能够具有固液共存状态的Sn合金和覆盖Sn合金表面的至少一部分的Au（或Au合金）涂层。 Au覆盖层是覆盖并涂覆Sn合金表面的至少一部分的膜。 作为优选的方式，Au涂层在Sn合金的表面上形成网状结构。 Au涂层的厚度例如为1〜5μm。

公开(公告)号：US07813921B2

公开(公告)日：2010-10-12

申请号：US11547322

申请日：2005-03-15

Applicant: Hajime Kobayashi ,  Soichi Toyama ,  Yasunori Suzuki

Inventor： Hajime Kobayashi ,  Soichi Toyama ,  Yasunori Suzuki

IPC: G10L21/02

CPC classification number: G10L15/065 ,  G10L15/20 ,  G10L2015/0635

Abstract: There is provided a voice recognition device and a voice recognition method that enhance the function of noise adaptation processing in voice recognition processing and reduce the capacity of a memory being used. Acoustic models are subjected to clustering processing to calculate the centroid of each cluster and the differential vector between the centroid and each model, model composition between each kind of assumed noise model and the calculated centroid is carried out, and the centroid of each composition model and the differential vector are stored in a memory. In the actual recognition processing, the centroid optimal to the environment estimated by the utterance environmental estimation is extracted from the memory, model restoration is carried out on the extracted centroid by using the differential vector stored in the memory, and noise adaptation processing is executed on the basis of the restored model.

Abstract translation: 提供了一种语音识别装置和语音识别方法，其增强了语音识别处理中噪声适应处理的功能，并降低了正在使用的存储器的容量。 对声学模型进行聚类处理，计算每个聚类的质心和质心与每个模型之间的差分向量，进行各种假设噪声模型与计算出的质心之间的模型组合，以及每个组合模型的质心和 差分矢量存储在存储器中。 在实际识别处理中，从存储器中提取通过语音环境估计估计的对环境最佳的质心，通过使用存储在存储器中的差分矢量对所提取的质心进行模型恢复，并且执行噪声适应处理 恢复模式的基础。

公开(公告)号：US07481587B2

公开(公告)日：2009-01-27

申请号：US11723871

申请日：2007-03-22

Applicant: Hajime Kobayashi ,  Yayoi Eguro ,  Nobuyoshi Mori ,  Hiroyuki Hattori ,  Yoshiharu Masaki ,  Fumiaki Yoshida ,  Yuichi Atarashi ,  Kazuhiro Wada ,  Kazuhiko Ishikawa

Inventor： Hajime Kobayashi ,  Yayoi Eguro ,  Nobuyoshi Mori ,  Hiroyuki Hattori ,  Yoshiharu Masaki ,  Fumiaki Yoshida ,  Yuichi Atarashi ,  Kazuhiro Wada ,  Kazuhiko Ishikawa

IPC: G02B6/36

CPC classification number: G02B6/4204 ,  G02B6/34 ,  G02B6/4246 ,  G02B6/4292

Abstract: An optical element used in a bidirectional optical communication module used for bidirectional optical fiber communication by a wavelength multiplex system, comprising a diffraction grating of binary structure prepared by molding, wherein a taper is formed at a portion of the diffraction grating where light entering the diffraction grating is intercepted by a convex part of the binary structure of the diffraction grating.

Abstract translation: 一种用于通过波长多路复用系统进行双向光纤通信的双向光通信模块中的光学元件，包括通过模制制备的二进制结构的衍射光栅，其中在衍射光栅的一部分处形成锥形，其中进入衍射 光栅由衍射光栅的二进制结构的凸部截取。