发明申请
- 专利标题： Semiconductor device and method for manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US12926558申请日： 2010-11-24
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公开(公告)号： US20110140269A1公开(公告)日： 2011-06-16
- 发明人: Fumihiro Bekku
- 申请人： Fumihiro Bekku
- 申请人地址： JP Kawasaki-shi, Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kawasaki-shi, Kanagawa
- 优先权： JP2009-284100 20091215
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
A semiconductor device includes an electrode pad and a protective insulating film having an opening to expose the electrode pad. The semiconductor device further includes a bump (resin core bump) that includes a bump core (resin core) formed on the protective insulating film and a conductive layer formed on the bump core. The semiconductor device further includes an interconnect that connects the conductive layer and the electrode pad. The bump core is in the form of a laminate of plural resin layers (for example, first and second resin layers) that have different elastic modulus.
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