公开(公告)号：US08378486B2

公开(公告)日：2013-02-19

申请号：US12923885

申请日：2010-10-13

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/11515 ,  H01L2224/11618 ,  H01L2224/11826 ,  H01L2224/13005 ,  H01L2224/13008 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/133 ,  H01L2224/13541 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/1411 ,  H01L2224/14151 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a protective insulating film, an opening formed in the protective insulating film, an electrode pad located within the opening, a bump formed on the protective insulating film, and an interconnect. The bump includes a bump core and a conductive film. The bump core includes an insulating resin layer and a conductive resin layer located on the insulating resin layer. The conductive film is formed on at least the upper surface of the bump core. The interconnect connects the conductive film of the bump and the electrode pad.

摘要翻译： 半导体器件包括保护绝缘膜，形成在保护绝缘膜中的开口，位于开口内的电极垫，形成在保护绝缘膜上的凸起和互连。 凸块包括凸块和导电膜。 凸块包括绝缘树脂层和位于绝缘树脂层上的导电树脂层。 至少在凸起芯的上表面上形成导电膜。 互连连接凸块的导电膜和电极垫。

公开(公告)号：US20110018137A1

公开(公告)日：2011-01-27

申请号：US12801367

申请日：2010-06-04

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/48 ,  H01L21/60 ,  H01L21/00

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/02313 ,  H01L2224/02321 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T29/41 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： A plurality of projections, respectively given later as cores of a plurality of external connection terminals, are formed first by selectively forming a curable resin layer over a protective insulating film; flat portions are then formed respectively on the top surfaces of the plurality of projections, by pressing a molding jig having a flat opposing surface onto the top surfaces of the plurality of projections, before the projections are cured; the plurality of projections are cured; and the plurality of external connection terminals, and the plurality of interconnects are formed, by selectively forming an electro-conductive film over the plurality of projections, the protective insulating film, and the plurality of electrode pads.

摘要翻译： 首先，通过在保护绝缘膜上选择性地形成固化树脂层，形成分别给出多个外部连接端子的芯的多个突起， 然后在突起固化之前，通过将具有平坦相对表面的成型夹具压在多个突起的顶表面上，分别在多个突起的顶表面上形成平坦部分; 多个突起被固化; 并且通过在所述多个突起，所述保护绝缘膜和所述多个电极焊盘上选择性地形成导电膜来形成所述多个外部连接端子和所述多个互连。

公开(公告)号：US08258005B2

公开(公告)日：2012-09-04

申请号：US13026726

申请日：2011-02-14

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/10126 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device includes forming an electrode pad in a surface layer of an insulating layer; disposing a conductive particle, of which at least a portion of the surface is coated with a thermoplastic resin, over the electrode pad; and fixing the conductive particle over the electrode pad using the resin, by heating the resin to soften the resin, and then cooling and solidifying the resin after the conductive particle and the electrode pad are electrically connected to each other, to form the conductive particle as an external connection terminal.

摘要翻译： 一种制造半导体器件的方法包括在绝缘层的表面层中形成电极焊盘; 在电极垫上设置其表面的至少一部分被热塑性树脂涂覆的导电颗粒; 并使用树脂将导电粒子固定在电极垫上，通过加热树脂来软化树脂，然后在导电粒子和电极垫彼此电连接之后冷却固化树脂，从而形成导电粒子作为 外部连接端子。

公开(公告)号：US08309471B2

公开(公告)日：2012-11-13

申请号：US12923072

申请日：2010-08-31

申请人： Yusaku Murabe ,  Fumihiro Bekku

发明人： Yusaku Murabe ,  Fumihiro Bekku

IPC分类号： H01L21/461 ,  H01L21/302 ,  H01L21/311

CPC分类号： H01L21/32134 ,  H01L21/67086 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/94 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/03

摘要： A layer to be etched is first formed in a substrate. Then, a mask pattern is formed over the layer to be etched. Then, the layer to be etched is wet-etched using the mask pattern as a mask. In the procedure of performing wet etching, the substrate is dipped into an etching bath with the mask pattern downward.

摘要翻译： 首先在衬底中形成待蚀刻的层。 然后，在待蚀刻的层上形成掩模图案。 然后，使用掩模图案作为掩模对待蚀刻的层进行湿蚀刻。 在进行湿式蚀刻的过程中，将基板浸入具有向下的掩模图案的蚀刻槽中。

公开(公告)号：US20110095420A1

公开(公告)日：2011-04-28

申请号：US12923885

申请日：2010-10-13

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/11515 ,  H01L2224/11618 ,  H01L2224/11826 ,  H01L2224/13005 ,  H01L2224/13008 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/133 ,  H01L2224/13541 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/1411 ,  H01L2224/14151 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a protective insulating film, an opening formed in the protective insulating film, an electrode pad located within the opening, a bump formed on the protective insulating film, and an interconnect. The bump includes a bump core and a conductive film. The bump core includes an insulating resin layer and a conductive resin layer located on the insulating resin layer. The conductive film is formed on at least the upper surface of the bump core. The interconnect connects the conductive film of the bump and the electrode pad.

摘要翻译： 半导体器件包括保护绝缘膜，形成在保护绝缘膜中的开口，位于开口内的电极垫，形成在保护绝缘膜上的凸起和互连。 凸块包括凸块和导电膜。 凸块包括绝缘树脂层和位于绝缘树脂层上的导电树脂层。 至少在凸起芯的上表面上形成导电膜。 互连连接凸块的导电膜和电极垫。

公开(公告)号：US20110053364A1

公开(公告)日：2011-03-03

申请号：US12923072

申请日：2010-08-31

申请人： Yusaku Murabe ,  Fumihiro Bekku

发明人： Yusaku Murabe ,  Fumihiro Bekku

IPC分类号： H01L21/441 ,  H01L21/467

CPC分类号： H01L21/32134 ,  H01L21/67086 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/94 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/03

摘要： A layer to be etched is first formed in a substrate. Then, a mask pattern is formed over the layer to be etched. Then, the layer to be etched is wet-etched using the mask pattern as a mask. In the procedure of performing wet etching, the substrate is dipped into an etching bath with the mask pattern downward.

摘要翻译： 首先在衬底中形成待蚀刻的层。 然后，在待蚀刻的层上形成掩模图案。 然后，使用掩模图案作为掩模对待蚀刻的层进行湿蚀刻。 在进行湿式蚀刻的过程中，将基板浸入具有向下的掩模图案的蚀刻槽中。

公开(公告)号：US08541300B2

公开(公告)日：2013-09-24

申请号：US12801367

申请日：2010-06-04

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/498

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/02313 ,  H01L2224/02321 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T29/41 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： A plurality of projections, respectively given later as cores of a plurality of external connection terminals, are formed first by selectively forming a curable resin layer over a protective insulating film; flat portions are then formed respectively on the top surfaces of the plurality of projections, by pressing a molding jig having a flat opposing surface onto the top surfaces of the plurality of projections, before the projections are cured; the plurality of projections are cured; and the plurality of external connection terminals, and the plurality of interconnects are formed, by selectively forming an electro-conductive film over the plurality of projections, the protective insulating film, and the plurality of electrode pads.

摘要翻译： 首先，通过在保护绝缘膜上选择性地形成固化树脂层，形成分别给出多个外部连接端子的芯的多个突起， 然后在突起固化之前，通过将具有平坦相对表面的成型夹具压在多个突起的顶表面上，分别在多个突起的顶表面上形成平坦部分; 多个突起被固化; 并且通过在所述多个突起，所述保护绝缘膜和所述多个电极焊盘上选择性地形成导电膜来形成所述多个外部连接端子和所述多个互连。

公开(公告)号：US20110201193A1

公开(公告)日：2011-08-18

申请号：US13026726

申请日：2011-02-14

申请人： Fumihiro BEKKU

发明人： Fumihiro BEKKU

IPC分类号： H01L21/441

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/10126 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device includes forming an electrode pad in a surface layer of an insulating layer; disposing a conductive particle, of which at least a portion of the surface is coated with a thermoplastic resin, over the electrode pad; and fixing the conductive particle over the electrode pad using the resin, by heating the resin to soften the resin, and then cooling and solidifying the resin after the conductive particle and the electrode pad are electrically connected to each other, to form the conductive particle as an external connection terminal.

摘要翻译： 一种制造半导体器件的方法包括在绝缘层的表面层中形成电极焊盘; 在电极垫上设置其表面的至少一部分被热塑性树脂涂覆的导电颗粒; 并使用树脂将导电粒子固定在电极垫上，通过加热树脂来软化树脂，然后在导电粒子和电极垫彼此电连接之后冷却固化树脂，从而形成导电粒子作为 外部连接端子。

公开(公告)号：US20110140269A1

公开(公告)日：2011-06-16

申请号：US12926558

申请日：2010-11-24

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/11515 ,  H01L2224/1182 ,  H01L2224/13008 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/1319 ,  H01L2224/13566 ,  H01L2224/13644 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A semiconductor device includes an electrode pad and a protective insulating film having an opening to expose the electrode pad. The semiconductor device further includes a bump (resin core bump) that includes a bump core (resin core) formed on the protective insulating film and a conductive layer formed on the bump core. The semiconductor device further includes an interconnect that connects the conductive layer and the electrode pad. The bump core is in the form of a laminate of plural resin layers (for example, first and second resin layers) that have different elastic modulus.

摘要翻译： 半导体器件包括电极焊盘和具有露出电极焊盘的开口的保护绝缘膜。 半导体器件还包括凸起（树脂芯凸起），其包括形成在保护绝缘膜上的凸起芯（树脂芯）和形成在凸点芯上的导电层。 半导体器件还包括连接导电层和电极焊盘的互连。 凸点芯是具有不同弹性模量的多个树脂层（例如第一和第二树脂层）的层压体的形式。

公开(公告)号：US20110059606A1

公开(公告)日：2011-03-10

申请号：US12876763

申请日：2010-09-07

申请人： Fumihiro BEKKU

发明人： Fumihiro BEKKU

IPC分类号： H01L21/475 ,  G03F1/00

CPC分类号： H01L24/13 ,  G03F1/50 ,  H01L24/14 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/13008 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/00

摘要： A photosensitive resin film is formed on a protective insulating film. Next, a plurality of bump cores is formed on the protective insulating film along a first straight line by exposing and developing the photosensitive resin film. Next, a plurality of bumps, and a plurality of interconnects that connects each of the plurality of bumps to any of the electrode pads are formed by selectively forming conductive films on a plurality of bump cores, a plurality of electrode pads, and the protective insulating film. In the step of forming a plurality of bump cores, a region bordering on the interconnect on the lateral faces of the bump core is formed to have a gentler slope than that of a region intersecting the first straight line, by exposing the photosensitive resin film only one time using a multi-gradation mask.

摘要翻译： 感光性树脂膜形成在保护绝缘膜上。 接下来，通过曝光和显影感光树脂膜，沿着第一直线在保护绝缘膜上形成多个凸起芯。 接下来，通过在多个凸点芯，多个电极焊盘和保护绝缘体上选择性地形成导电膜来形成将多个凸点连接到任何电极焊盘的多个凸块和多个互连件 电影。 在形成多个凸起芯的步骤中，通过仅曝光感光性树脂膜，形成与凸点芯的侧面上的互连区域相邻的区域，其具有比与第一直线相交的区域更平缓的斜率 一次使用多等级面具。