发明申请
- 专利标题: PACKAGE STRUCTURE HAVING MEMS ELEMENT
- 专利标题(中): 具有MEMS元件的封装结构
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申请号: US12769993申请日: 2010-04-29
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公开(公告)号: US20110175179A1公开(公告)日: 2011-07-21
- 发明人: Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
- 申请人: Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
- 申请人地址: TW Taichung
- 专利权人: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址: TW Taichung
- 优先权: TW099101443 20100120
- 主分类号: H01L29/84
- IPC分类号: H01L29/84 ; H01L23/52
摘要:
A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.
公开/授权文献
- US08866236B2 Package structure having MEMS element 公开/授权日:2014-10-21