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公开(公告)号：US08420430B2
公开(公告)日：2013-04-16
申请号：US12769087
申请日：2010-04-28
申请人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
发明人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
CPC分类号： B81B7/0064 , B81B7/007 , B81B2207/095 , H01L21/56 , H01L23/315 , H01L23/552 , H01L24/48 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.
摘要翻译： 提供具有至少MEMS元件的封装结构的制造方法，包括：制备具有电连接焊盘和所述至少MEMS元件的晶片; 设置用于覆盖所述至少一个MEMS元件的盖，所述盖具有在其上形成的金属层; 电连接焊盘和金属层与接合线; 形成用于覆盖盖子，接合线，电连接垫和金属层的密封剂; 去除所述密封剂的部分以将所述接合线分别分离成第一和第二子接合线，其中所述第一和第二次接合线的顶端被暴露，所述第一子接合线电连接到所述电连接焊盘，以及 所述第二子接合线电连接到所述金属层; 在所述密封剂上形成用于电连接到所述第一子接合线的金属迹线; 在金属痕迹上形成凸块; 并执行单独处理。
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公开(公告)号：US20110177643A1
公开(公告)日：2011-07-21
申请号：US12769087
申请日：2010-04-28
申请人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
发明人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
CPC分类号： B81B7/0064 , B81B7/007 , B81B2207/095 , H01L21/56 , H01L23/315 , H01L23/552 , H01L24/48 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.
摘要翻译： 提供具有至少MEMS元件的封装结构的制造方法，包括：制备具有电连接焊盘和所述至少MEMS元件的晶片; 设置用于覆盖所述至少一个MEMS元件的盖，所述盖具有在其上形成的金属层; 电连接焊盘和金属层与接合线; 形成用于覆盖盖子，接合线，电连接垫和金属层的密封剂; 去除所述密封剂的部分以将所述接合线分别分离成第一和第二子接合线，其中所述第一和第二次接合线的顶端被暴露，所述第一子接合线电连接到所述电连接焊盘，以及 所述第二子接合线电连接到所述金属层; 在所述密封剂上形成用于电连接到所述第一子接合线的金属迹线; 在金属痕迹上形成凸块; 并执行单独处理。
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公开(公告)号：US20110175179A1
公开(公告)日：2011-07-21
申请号：US12769993
申请日：2010-04-29
申请人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
发明人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
CPC分类号： B81B7/0064 , B81B7/007 , B81B2207/095 , H01L21/56 , H01L23/315 , H01L23/552 , H01L24/48 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.
摘要翻译： 提供具有至少MEMS元件的封装结构，其包括具有电连接焊盘和MEMS元件的芯片; 设置在所述芯片上以覆盖所述MEMS元件并且具有设置在其上的金属层的盖; 电连接到电连接焊盘的第一子接合线; 电连接到金属层的第二子接合线; 设置在所述芯片上的密封剂，其中所述第一和第二子接合线的顶端从所述密封剂露出; 以及设置在密封剂上并电连接到第一子接合线的金属迹线。 封装结构有利地具有减小的尺寸，相对低的成本，不同的凸起位置和增强的EMI屏蔽效果。
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公开(公告)号：US08866236B2
公开(公告)日：2014-10-21
申请号：US12769993
申请日：2010-04-29
申请人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
发明人： Chi-Hsin Chiu , Chih-Ming Huang , Chang-Yueh Chan , Hsin-Yi Liao , Chun-Chi Ke
CPC分类号： B81B7/0064 , B81B7/007 , B81B2207/095 , H01L21/56 , H01L23/315 , H01L23/552 , H01L24/48 , H01L2224/48227 , H01L2224/48465 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.
摘要翻译： 提供具有至少MEMS元件的封装结构，其包括具有电连接焊盘和MEMS元件的芯片; 设置在所述芯片上以覆盖所述MEMS元件并且具有设置在其上的金属层的盖; 电连接到电连接焊盘的第一子接合线; 电连接到金属层的第二子接合线; 设置在所述芯片上的密封剂，其中所述第一和第二子接合线的顶端从所述密封剂露出; 以及设置在密封剂上并电连接到第一子接合线的金属迹线。 封装结构有利地具有减小的尺寸，相对低的成本，不同的凸起位置和增强的EMI屏蔽效果。
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公开(公告)号：US08564115B2
公开(公告)日：2013-10-22
申请号：US13492220
申请日：2012-06-08
IPC分类号： H01L23/04
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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6.发明授权Package structure having micro-electromechanical element and fabrication method thereof 有权具有微机电元件的封装结构及其制造方法公开(公告)号：US08198689B2
公开(公告)日：2012-06-12
申请号：US12769041
申请日：2010-04-28
IPC分类号： H01L23/485
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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7.发明申请PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT AND FABRICATION METHOD THEREOF 有权具有微电子元件的包装结构及其制造方法公开(公告)号：US20110156180A1
公开(公告)日：2011-06-30
申请号：US12769041
申请日：2010-04-28
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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公开(公告)号：US20080296716A1
公开(公告)日：2008-12-04
申请号：US12151570
申请日：2008-05-07
CPC分类号： H01L21/56 , H01L23/3114 , H01L27/14618 , H01L27/14683 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A sensor semiconductor device and a manufacturing method thereof are disclosed. The method includes: providing a light-permeable carrier board with a plurality of metallic circuits; electrically connecting the metallic circuits to a plurality of sensor chips through conductive bumps formed on the bond pads of the sensor chips, wherein the sensor chips have been previously subjected to thinning and chip probing; filling a first dielectric layer between the sensor chips to cover the metallic circuits and peripheries of the sensor chips; forming a second dielectric layer on the sensor chips and the first dielectric layer; forming grooves between the sensor chips for exposing the metallic circuits such that a plurality of conductive traces electrically connected to the metallic circuits can be formed on the second dielectric layer; and singulating the sensor chips to form a plurality of sensor semiconductor devices. The present invention overcomes the drawbacks of breakage of trace connection due to a sharp angle formed at joints, poor electrical connection and chip damage due to an alignment error in cutting from the back of the wafer, as well as an increased cost due to multiple sputtering processes for forming traces.
摘要翻译： 公开了一种传感器半导体器件及其制造方法。 该方法包括：提供具有多个金属电路的透光性载板; 通过形成在传感器芯片的接合焊盘上的导电凸块将金属电路电连接到多个传感器芯片，其中传感器芯片已经预先经受了薄化和芯片探测; 在传感器芯片之间填充第一电介质层以覆盖金属电路和传感器芯片的周边; 在所述传感器芯片和所述第一介电层上形成第二电介质层; 在所述传感器芯片之间形成用于暴露所述金属电路的槽，使得可以在所述第二介电层上形成电连接到所述金属电路的多个导电迹线; 并且分离传感器芯片以形成多个传感器半导体器件。 本发明克服了由于在接头处形成的尖角导致的迹线连接断裂的缺点，由于从晶片背面的切割中的对准误差导致的不良电连接和芯片损坏以及由于多次溅射而导致的成本增加 形成痕迹的过程。
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公开(公告)号：US20120241937A1
公开(公告)日：2012-09-27
申请号：US13492220
申请日：2012-06-08
IPC分类号： H01L23/498
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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10.发明授权Chip scale package with electronic component received in encapsulant, and fabrication method thereof 有权具有接收在密封剂中的电子部件的芯片级封装及其制造方法公开(公告)号：US09040361B2
公开(公告)日：2015-05-26
申请号：US12959148
申请日：2010-12-02
CPC分类号： H01L24/82 , H01L23/3128 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L25/105 , H01L2224/12105 , H01L2224/24225 , H01L2224/25171 , H01L2224/32155 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/15311 , H01L2924/3511
摘要： A CSP includes: a hard board having a first wiring layer with conductive pads; a plurality of conductive elements disposed on at least a portion of the conductive pads; an electronic component having opposite active and inactive surfaces and being mounted on the hard board via the inactive surface; an encapsulating layer disposed on the hard board for encapsulating the conductive elements and electronic component, the active surface of the electronic component and the surfaces of the conductive elements being exposed through the encapsulating layer; a first dielectric layer and a third wiring layer disposed on the encapsulating layer, the third wiring layer being electrically connected to the conductive elements and the electronic component and further electrically connected to the first wiring layer through the conductive elements, thereby obtaining a stacked connection structure without the need of PTHs and using the hard board as a main structure to avoid warpage.
摘要翻译： CSP包括：具有带导电焊盘的第一布线层的硬板; 布置在所述导电垫的至少一部分上的多个导电元件; 电子元件具有相反的有源和无效表面，并且经由非活性表面安装在硬板上; 设置在所述硬板上用于封装所述导电元件和电子部件的封装层，所述电子部件的所述有源表面和所述导电元件的表面通过所述封装层露出; 设置在所述封装层上的第一电介质层和第三布线层，所述第三布线层电连接到所述导电元件和所述电子部件，并且还通过所述导电元件与所述第一布线层电连接，从而获得堆叠连接结构 不需要PTH和使用硬板作为主要结构，以避免翘曲。
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