发明申请
- 专利标题: EMI SHIELDING PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- 专利标题(中): EMI屏蔽包装结构及其制造方法
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申请号: US12769053申请日: 2010-04-28
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公开(公告)号: US20110175210A1公开(公告)日: 2011-07-21
- 发明人: Chin-Tsai Yao , Chien-Ping Huang , Chun-Chi Ke
- 申请人: Chin-Tsai Yao , Chien-Ping Huang , Chun-Chi Ke
- 申请人地址: TW Taichung
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW Taichung
- 优先权: TW099101178 20100118
- 主分类号: H01L23/552
- IPC分类号: H01L23/552 ; H01L21/78
摘要:
An EMI shielding package structure includes a substrate unit having a first surface with a die mounting area and a second surfaces opposite to the first surface, metallic pillars formed on the first surface, a chip mounted on and electrically connected to the die-mounting area, an encapsulant covering the chip and the first surface while exposing a portion of each of the metallic pillars from the encapsulant, and a shielding film enclosing the encapsulant and electrically connecting to the metallic pillars. A fabrication method of the above structure by two cutting processes is further provided. The first cutting process forms grooves by cutting the encapsulant. After a shielding film is formed in the grooves and electrically connected to the metallic pillars, the complete package structure is formed by the second cutting process, thereby simplifying the fabrication process while overcoming inferior grounding of the shielding film as encountered in prior techniques.