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发明申请
US20110175238A1 Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip 审中-公开
生产半导体芯片的方法和相应的半导体芯片

  • 专利标题： Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
  • 专利标题（中）： 生产半导体芯片的方法和相应的半导体芯片
  • 申请号： US12746096
    申请日： 2008-12-08
  • 公开(公告)号： US20110175238A1
    公开(公告)日： 2011-07-21
  • 发明人: Stefan Illek
  • 申请人： Stefan Illek
  • 优先权： DE102007061469.3 20071220; DE102008014121.6 20080313
  • 国际申请： PCT/DE2008/002056 WO 20081208
  • 主分类号： H01L23/12
  • IPC分类号： H01L23/12 ;  H01L21/50
Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
摘要：
A method for producing a plurality of semiconductor chips is specified. A plurality of semiconductor bodies is provided on a substrate, wherein the semiconductor bodies are spaced apart from one another by interspaces. A structured carrier is provided, having a plurality of elevations. The structured carrier is positioned relative to the substrate in such a way that the elevations of the structured carrier extend into the interspaces between the semiconductor bodies A mechanically stable assemblage is produced, comprising the substrate and the structured carrier. The assemblage is singulated into a plurality of semiconductor chips.
摘要（中）：

规定了制造多个半导体芯片的方法。 多个半导体本体设置在基板上，其中半导体主体通过间隙彼此间隔开。 提供具有多个高度的结构化载体。 结构化载体相对于基底定位成使得结构化载体的隆起延伸到半导体体之间的间隙中。产生包括基底和结构化载体的机械稳定的组合。 该组合被分成多个半导体芯片。

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