公开(公告)号：US08811448B2

公开(公告)日：2014-08-19

申请号：US13120752

申请日：2009-08-31

申请人： Stefan Illek

发明人： Stefan Illek

IPC分类号： H01S3/091 ,  H01S5/04 ,  H01S5/183 ,  H01S5/14 ,  H01S5/18 ,  H01S5/00 ,  H01S5/02 ,  H01S5/40 ,  H01S5/022

CPC分类号： H01S5/183 ,  H01L2224/48463 ,  H01S5/0071 ,  H01S5/0215 ,  H01S5/0217 ,  H01S5/02272 ,  H01S5/041 ,  H01S5/14 ,  H01S5/18 ,  H01S5/4031

摘要： An optoelectronic component includes an optical pump device including a first radiation-generating layer and a first radiation exit area at a top side of the pump device, wherein electromagnetic radiation generated during operation of the pump device is coupled out from the pump device through the first radiation exit area transversely and at least in part non-perpendicularly with respect to the first radiation-generating layer, and a surface emitting semiconductor laser chip including a reflective layer sequence including a Bragg mirror, and a second radiation-generating layer, wherein the surface emitting semiconductor laser chip is fixed to the top side of the pump device, and the reflective layer sequence is arranged between the first radiation exit area and the second radiation-generating layer.

摘要翻译： 光电子部件包括光泵装置，其包括位于泵装置顶侧的第一辐射产生层和第一辐射出口区域，其中在泵装置操作期间产生的电磁辐射通过第一 横向且至少部分地相对于第一辐射产生层非垂直的辐射出射面以及包括布拉格反射镜和第二辐射产生层的反射层序列的表面发射半导体激光器芯片，其中表面 发射半导体激光器芯片固定在泵装置的顶侧，并且反射层序列被布置在第一辐射出射区域和第二辐射产生层之间。

公开(公告)号：US08536603B2

公开(公告)日：2013-09-17

申请号：US13123779

申请日：2009-10-12

申请人： Stefan Illek ,  Uwe Strauss

发明人： Stefan Illek ,  Uwe Strauss

IPC分类号： H01L33/00

CPC分类号： H01S5/12 ,  H01L33/14 ,  H01L2924/0002 ,  H01S5/0421 ,  H01S5/06256 ,  H01S5/1228 ,  H01S5/1231 ,  H01S5/209 ,  H01L2924/00

摘要： An optoelectronic semiconductor chip having a semiconductor layer sequence with a plurality of layers arranged over one another includes an active layer with an active region which emits electromagnetic radiation in an emission direction when in operation, a first grating layer on the active layer which, in an emission direction, has a plurality of stripes in the form of grating lines extending perpendicularly to the emission direction with spaces arranged therebetween, and a second grating layer on the first grating layer which covers the stripes of the first grating layer and the spaces and which comprises a transparent material applied by non-epitaxial application.

摘要翻译： 具有彼此排列的多个层的半导体层序列的光电子半导体芯片包括：有源层，具有在工作时发射方向上发射电磁辐射的有源区;活性层上的第一光栅层， 发射方向具有垂直于发射方向延伸的格栅线的形式的多个条纹，并且其间具有间隔布置的第一光栅层和覆盖第一光栅层和空间的条纹的第二光栅层，并且包括 通过非外延应用施加的透明材料。

公开(公告)号：US08314430B2

公开(公告)日：2012-11-20

申请号：US12597682

申请日：2008-04-25

申请人： Stefan Illek ,  Andreas Ploessl ,  Alexander Heindl ,  Patrick Rode ,  Dieter Eissler

发明人： Stefan Illek ,  Andreas Ploessl ,  Alexander Heindl ,  Patrick Rode ,  Dieter Eissler

IPC分类号： H01L27/15 ,  H01L33/00 ,  H01L21/00

摘要： An optoelectronic component with a semiconductor body includes an active region suitable for generating radiation, and two electrical contacts arranged on the semiconductor body. The contacts are electrically connected to the active region. The contacts each have a connecting face that faces away from the semiconductor body. The contact faces are located on a connection side of the component and a side of the component that is different from the connection side is mirror-coated. A method for the manufacture of multiple components of this sort is also disclosed.

公开(公告)号：US08102060B2

公开(公告)日：2012-01-24

申请号：US12301566

申请日：2007-05-16

申请人： Andreas Plössl ,  Stefan Illek

发明人： Andreas Plössl ,  Stefan Illek

IPC分类号： H01L23/48

CPC分类号： H05K3/321 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/0079 ,  H01L33/20 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15788 ,  H01L2924/19043 ,  H05K2201/0373 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device comprising a first component (5) having a first surface (6), a second component (8) having a second surface (9) and a connection layer (7) between the first surface (6) of the first component (5) and the second surface (9) of the second component (8), wherein the connection layer (7) comprises an electrically insulating adhesive and there is an electrically conductive contact between the first surface (6) of the first component (5) and the second surface (9) of the second component (8).

摘要翻译： 一种装置，包括具有第一表面（6）的第一部件（5），具有第二表面（9）的第二部件（8）和在第一部件（5）的第一表面（6）之间的连接层 ）和第二部件（8）的第二表面（9），其中连接层（7）包括电绝缘粘合剂，并且在第一部件（5）的第一表面（6）和 第二部件（8）的第二表面（9）。

公开(公告)号：US07995633B2

公开(公告)日：2011-08-09

申请号：US12371292

申请日：2009-02-13

申请人： Juergen Dachs ,  Stefan Illek ,  Roland Schulz ,  Thomas Schwarz ,  Frank Singer ,  Heiko Unold

发明人： Juergen Dachs ,  Stefan Illek ,  Roland Schulz ,  Thomas Schwarz ,  Frank Singer ,  Heiko Unold

IPC分类号： H01S5/00 ,  H01L21/00

CPC分类号： H01S5/0201

摘要： A method for producing a multiplicity of semiconductor lasers (100) comprising the steps of providing a carrier wafer (30), producing an assembly (70) by applying a multiplicity of semiconductor laser chips (4) to a top side (31) of the carrier wafer (30), and singulating the assembly (70) to form a multiplicity of semiconductor lasers (100). Each semiconductor laser (100) comprises a mounting block (3) and at least one semiconductor laser chip (4). Each mounting block (3) has a mounting area (13) which runs substantially perpendicular to a top side (12) of the mounting block (3), on which top side the semiconductor laser chip (4) is arranged. The mounting area (13) is produced during the singulation of the assembly.

摘要翻译： 一种用于制造多个半导体激光器（100）的方法，包括以下步骤：提供载体晶片（30），通过将多个半导体激光器芯片（4）施加到所述多个半导体激光器的顶侧（31）来产生组件（70） 载体晶片（30），并且分割组件（70）以形成多个半导体激光器（100）。 每个半导体激光器（100）包括安装块（3）和至少一个半导体激光器芯片（4）。 每个安装块（3）具有基本上垂直于安装块（3）的顶侧（12）延伸的安装区域（13），其上布置有半导体激光器芯片（4）的顶侧。 安装区域（13）在组件的分割过程中产生。

公开(公告)号：US07208337B2

公开(公告)日：2007-04-24

申请号：US10529673

申请日：2003-09-05

申请人： Dominik Eisert ,  Stefan Illek ,  Wolfgang Schmid

发明人： Dominik Eisert ,  Stefan Illek ,  Wolfgang Schmid

IPC分类号： H01L21/00 ,  H01L21/46 ,  H01L21/78 ,  H01L21/301

CPC分类号： H01L33/20 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/29014 ,  H01L2224/29124 ,  H01L2224/29164 ,  H01L2224/29169 ,  H01L2224/83203 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor component having a light-emitting semiconductor layer or a light-emitting semiconductor element, two contact locations and a vertically or horizontally patterned carrier substrate, and a method for producing a semiconductor component are disclosed for the purpose of reducing or compensating for the thermal stresses in the component. The thermal stresses arise as a result of temperature changes during processing and during operation and on account of the different expansion coefficients of the semiconductor and carrier substrate. The carrier substrate is patterned in such a way that the thermal stresses are reduced or compensated for sufficiently to ensure that the component does not fail.

摘要翻译： 公开了具有发光半导体层或发光半导体元件，两个接触位置和垂直或水平图案化载体衬底的半导体部件以及用于制造半导体部件的方法，用于减少或补偿热 组件中的压力。 热应力由于处理过程中和工作期间的温度变化以及由于半导体和载体衬底的不同膨胀系数而产生。 载体基板被图案化，使得热应力被减少或补偿以充分确保部件不失败。

公开(公告)号：US06995030B2

公开(公告)日：2006-02-07

申请号：US10346605

申请日：2003-01-17

申请人： Stefan Illek ,  Klaus Streubel ,  Walter Wegletter ,  Andreas Ploessl ,  Ralph Wirth

发明人： Stefan Illek ,  Klaus Streubel ,  Walter Wegletter ,  Andreas Ploessl ,  Ralph Wirth

IPC分类号： H01L21/00

CPC分类号： H01L33/20 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/10 ,  H01L33/30 ,  H01L33/405 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic semiconductor chip has an active layer containing a photon-emitting zone. The active layer is attached to a carrier member at a bonding side of the active layer. The active layer has at least one recess therein with a cross-sectional area that decreases with increasing depth into said active layer proceeding from said bonding side.

公开(公告)号：US5260960A

公开(公告)日：1993-11-09

申请号：US872401

申请日：1992-04-23

申请人： Markus-Christian Amann ,  Stefan Illek ,  Wolfgang Thulke

发明人： Markus-Christian Amann ,  Stefan Illek ,  Wolfgang Thulke

IPC分类号： H01S5/00 ,  H01S5/02 ,  H01S5/026 ,  H01S5/06 ,  H01S5/062 ,  H01S5/227 ,  H01S3/19

CPC分类号： H01S5/06206 ,  H01S5/227 ,  H01S5/0208 ,  H01S5/2275

摘要： A tunable laser diode on a semi-insulating substrate having a stripe-shaped layer structure has an intermediate layer between an active layer and a tuning layer that is grown-over by an confinement layer that is doped for the same conductivity type as the intermediate layer. An oppositely doped, lateral region is electrically connected via an identically doped lower region to the active layer. An upper region is likewise oppositely doped and is electrically connected to the tuning layer. A contact layer is essentially planarly applied on the surface of the confinement layer and has respective portions on the appertaining regions on which the contacts provided with adequate bond areas are applied with a further contact layer for the common contact.

摘要翻译： 具有条形层结构的半绝缘衬底上的可调谐激光二极管在有源层和调谐层之间具有中间层，该中间层由掺杂与中间层相同的导电类型的约束层生长 。 相对掺杂的横向区域经由相同掺杂的下部区域电连接到有源层。 上部区域同样相反地掺杂并且电连接到调谐层。 接触层基本上平面地施加在限制层的表面上，并且在其上具有足够粘合区域的触点上的相应部分被施加有用于共同接触的另外的接触层。

公开(公告)号：US10062320B2

公开(公告)日：2018-08-28

申请号：US14110412

申请日：2012-03-01

申请人： Stefan Illek ,  Norwin von Malm ,  Tilman Ruegheimer

发明人： Stefan Illek ,  Norwin von Malm ,  Tilman Ruegheimer

IPC分类号： H01S3/04 ,  G09G3/3208 ,  H01L25/075 ,  G09G3/32

CPC分类号： G09G3/3208 ,  G09G3/32 ,  H01L25/0753

摘要： A display device includes a multiplicity of pixels, at least one connection carrier, and a multiplicity of inorganic light-emitting diode chips. The connection carrier includes a multiplicity of switches. Each pixel contains at least one light-emitting diode chip. Each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier. Each switch is designed for driving at least one light-emitting diode chip and the light-emitting diode chips are imaging elements of the display device.

公开(公告)号：US09548433B2

公开(公告)日：2017-01-17

申请号：US13878673

申请日：2011-09-28

申请人： Stefan Illek ,  Ulrich Steegmüller ,  Norwin von Malm

发明人： Stefan Illek ,  Ulrich Steegmüller ,  Norwin von Malm

IPC分类号： H01L31/12 ,  H01L33/62 ,  H01L27/15

CPC分类号： H01L33/62 ,  H01L27/153 ,  H01L2224/48463

摘要： A light-emitting diode chip includes at least two semiconductor bodies, each semiconductor body including at least one active area that generates radiation, a carrier having a top side and an underside facing away from the top side, and an electrically insulating connector arranged at the top side of the carrier, wherein the electrically insulating connector is arranged between the semiconductor bodies and the top side of the carrier, the electrically insulating connector imparts a mechanical contact between the semiconductor bodies and the carrier, and at least some of the semiconductor bodies electrically connect in series with one another.

摘要翻译： 发光二极管芯片包括至少两个半导体本体，每个半导体主体包括产生辐射的至少一个有效区域，具有顶侧和背面离开顶侧的载体;以及电绝缘连接器， 所述电绝缘连接器设置在所述半导体主体和所述载体的顶侧之间，所述电绝缘连接器在所述半导体主体和所述载体之间施加机械接触，并且所述半导体主体中的至少一些电 相互连接。