发明申请
US20110177671A1 METHODS OF FORMING A SEMICONDUCTOR CELL ARRAY REGION, METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING THE SEMICONDUCTOR CELL ARRAY REGION, AND METHOD OF FORMING A SEMICONDUCTOR MODULE INCLUDING THE SEMICONDUCTOR DEVICE
审中-公开
形成半导体单元阵列区域的方法，形成包括半导体单元阵列区域的半导体器件的方法以及形成包括半导体器件的半导体器件的方法
- 专利标题： METHODS OF FORMING A SEMICONDUCTOR CELL ARRAY REGION, METHOD OF FORMING A SEMICONDUCTOR DEVICE INCLUDING THE SEMICONDUCTOR CELL ARRAY REGION, AND METHOD OF FORMING A SEMICONDUCTOR MODULE INCLUDING THE SEMICONDUCTOR DEVICE
- 专利标题（中）： 形成半导体单元阵列区域的方法，形成包括半导体单元阵列区域的半导体器件的方法以及形成包括半导体器件的半导体器件的方法
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申请号： US12958858申请日： 2010-12-02
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公开(公告)号： US20110177671A1公开(公告)日： 2011-07-21
- 发明人: Sung-Woo HYUN , Byeong-Chan LEE , Sun-Ghil LEE , Yong-Hoon SON
- 申请人： Sung-Woo HYUN , Byeong-Chan LEE , Sun-Ghil LEE , Yong-Hoon SON
- 优先权： KR10-2010-0003813 20100115
- 主分类号： H01L21/762
- IPC分类号： H01L21/762
摘要：
Methods of forming a semiconductor cell array region, a method of forming a semiconductor device including the semiconductor cell array region, and a method of forming a semiconductor module including the semiconductor device are provided, the methods of forming the semiconductor cell array region include preparing a semiconductor plate. A semiconductor layer may be formed over the semiconductor plate. The semiconductor layer may be etched to form semiconductor pillars over the semiconductor plate.