发明申请
- 专利标题: Manufacturing Methods for Solid State Light Sheet or Strip with LEDs Connected in Series for General Illumination
- 专利标题(中): 固态灯片或带状LED的制造方法,串联连接用于一般照明
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申请号: US13044456申请日: 2011-03-09
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公开(公告)号: US20110193114A1公开(公告)日: 2011-08-11
- 发明人: Louis Lerman , Allan Brent York , Michael David Henry , Robert Steele , Brian D. Ogonowsky
- 申请人: Louis Lerman , Allan Brent York , Michael David Henry , Robert Steele , Brian D. Ogonowsky
- 申请人地址: US NV Las Vegas
- 专利权人: QUARKSTAR, LLC
- 当前专利权人: QUARKSTAR, LLC
- 当前专利权人地址: US NV Las Vegas
- 主分类号: H01L33/08
- IPC分类号: H01L33/08 ; H01L33/62
摘要:
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
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