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公开(公告)号：US20120268932A1
公开(公告)日：2012-10-25
申请号：US13538093
申请日：2012-06-29
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后将具有导体的透明顶部衬底层压在底部衬底上。 多个实施例一起描述了串联连接LED的各种方式。 光片可以形成为从光片的相对表面发光，使其能够用于悬挂固定装置中以照亮天花板以及地板。 照明板为标准的2×4脚荧光天花板灯具提供了实用的替代品。
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2.发明申请Manufacturing Methods for Solid State Light Sheet or Strip with LEDs Connected in Series for General Illumination 有权固态灯片或带状LED的制造方法，串联连接用于一般照明公开(公告)号：US20110193114A1
公开(公告)日：2011-08-11
申请号：US13044456
申请日：2011-03-09
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。
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3.发明授权公开(公告)号：US06771047B1
公开(公告)日：2004-08-03
申请号：US10349821
申请日：2003-01-22
申请人： Brian D. Ogonowsky
发明人： Brian D. Ogonowsky
IPC分类号： H02J700
CPC分类号： H02J7/0075
摘要： A technique for prolonging the life of a rechargeable battery in a computer is disclosed, wherein an automatic discharging and charging cycle occurs only during a time when the user does not anticipate ever needing to operate the computer using the battery. In another technique for prolonging the life of a rechargeable battery, to eliminate frequent topping off of the battery's charge by the computer's recharging routine, the battery is only automatically topped off after a relatively long interval if the computer remains plugged in. Such topping off may occur after the battery charge has fallen to a certain charge level or only after an extended time period. The time period may be set by the user. By topping off less frequently, the battery life is extended.
摘要翻译： 公开了一种用于延长计算机中的可充电电池的寿命的技术，其中自动放电和充电循环仅在用户不期望使用电池操作计算机的时间期间发生。 在延长可再充电电池寿命的另一种技术中，为了通过计算机的充电程序消除频繁的电池充电问题，如果计算机保持插入，电池只能在相对长的时间间隔内自动顶起。 在电池充电已经下降到一定的充电水平之后或仅在延长的时间段之后发生。 时间段可以由用户设定。 电池寿命延长，从而更频繁地排出。
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公开(公告)号：US20120268931A1
公开(公告)日：2012-10-25
申请号：US13537936
申请日：2012-06-29
CPC分类号： F21V29/70 , F21K9/00 , F21K9/27 , F21K9/60 , F21K9/90 , F21S8/06 , F21V19/005 , F21V23/00 , F21V29/89 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/62 , H01L2924/0002 , H05K1/0204 , H05K1/0206 , H05K1/183 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate having conductors is then laminated over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. The light sheets may be formed to emit light from opposite surfaces of the light sheet, enabling it to be used in a hanging fixture to illuminate the ceiling as well as the floor. The light sheet provides a practical substitute for a standard 2×4 foot fluorescent ceiling fixture.
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5.发明授权Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination 有权具有串联连接用于一般照明的LED的固态光片或条带的制造方法公开(公告)号：US08198109B2
公开(公告)日：2012-06-12
申请号：US13044456
申请日：2011-03-09
IPC分类号： H01L21/00
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate. In another embodiment, a conductor layer is formed on the outer surface of the top substrate and makes contact with the LED electrodes and conductors on the bottom substrate via openings formed in the top substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。 在另一个实施例中，导体层形成在顶部基板的外表面上，并通过形成在顶部基板中的开口与底部基板上的LED电极和导体接触。
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6.发明申请公开(公告)号：US20110193106A1
公开(公告)日：2011-08-11
申请号：US13079717
申请日：2011-04-04
IPC分类号： H01L33/08
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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7.发明申请Solid State Light Sheet for General Illumination Having Substrates for Creating Series Connection of Dies 有权用于一般照明的固态照明板，具有用于创建连接模块的基板公开(公告)号：US20110193105A1
公开(公告)日：2011-08-11
申请号：US13079706
申请日：2011-04-04
IPC分类号： H01L33/08
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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公开(公告)号：US20130039090A1
公开(公告)日：2013-02-14
申请号：US13570243
申请日：2012-08-08
申请人： Wilson Dau , Robert C. Gardner , George Lerman , Louis Lerman , Christopher H. Lowery , Brian D. Ogonowsky , George E. Smith , Ingo Speier , Robert V. Steele , Jacqueline Teng , Allan Brent York
发明人： Wilson Dau , Robert C. Gardner , George Lerman , Louis Lerman , Christopher H. Lowery , Brian D. Ogonowsky , George E. Smith , Ingo Speier , Robert V. Steele , Jacqueline Teng , Allan Brent York
CPC分类号： G02B6/0096 , F21S8/04 , F21V7/0016 , F21V7/0025 , F21V7/0033 , F21Y2103/10 , F21Y2115/10 , G02B6/0001 , G02B6/0011
摘要： A variety of illumination devices are disclosed that are configured to manipulate light provided by one or more light-emitting elements (LEEs). In general, embodiments of the illumination devices feature one or more optical couplers that redirect illumination from the LEEs to a reflector which then directs the light into a range of angles. In some embodiments, the illumination device includes a second reflector that reflects at least some of the light from the first reflector. In certain embodiments, the illumination device includes a light guide that guides light from the collector to the first reflector. The components of the illumination device can be configured to provide illumination devices that can provide a variety of intensity distributions. Such illumination devices can be configured to provide light for particular lighting applications, including office lighting, task lighting, cabinet lighting, garage lighting, wall wash, stack lighting, and downlighting.
摘要翻译： 公开了被配置为操纵由一个或多个发光元件（LEE）提供的光的各种照明装置。 通常，照明装置的实施例具有一个或多个光学耦合器，其将照明从LEE重定向到反射器，然后将反射器引导到一定范围的角度。 在一些实施例中，照明装置包括反射来自第一反射器的至少一些光的第二反射器。 在某些实施例中，照明装置包括将来自收集器的光引导到第一反射器的光导。 照明装置的部件可以被配置成提供能够提供各种强度分布的照明装置。 这种照明装置可以被配置为为特定的照明应用提供光线，包括办公照明，任务照明，橱柜照明，车库照明，洗墙，堆照明和筒灯。
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9.发明授权公开(公告)号：US08338842B2
公开(公告)日：2012-12-25
申请号：US13100247
申请日：2011-05-03
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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10.发明授权Solid state light sheet or strip having cavities formed in bottom substrate 有权具有形成在底部基板中的空腔的固态光片或条带公开(公告)号：US08338840B2
公开(公告)日：2012-12-25
申请号：US13096814
申请日：2011-04-28
CPC分类号： F21K9/30 , F21K9/20 , F21K9/64 , F21S8/06 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L33/08 , H01L33/507 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2933/0075 , H01S5/4025 , H01L2924/00
摘要： A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
摘要翻译： 公开了一种固态光片及其制造方法。 在一个实施例中，裸LED芯片具有顶部和底部电极，其中底部电极是大的反射电极。 LED阵列的底部电极（例如，500个LED）被结合到形成在柔性底部基底上的电极阵列。 在与电极连接的底部基板上形成导电迹线。 然后在底部衬底上形成透明的顶部衬底。 多个实施例一起描述了串联连接LED的各种方式。 在一种方法中，顶部衬底包含连接到LED电极和底部衬底上的导体的导体图案。
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