发明申请
- 专利标题： Apparatus and Method of Wafer Bonding Using Compatible Alloy
- 专利标题（中）： 使用兼容合金的晶圆接合的装置和方法
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申请号： US13082834申请日： 2011-04-08
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公开(公告)号： US20110212563A1公开(公告)日： 2011-09-01
- 发明人: John R. Martin , Timothy J. Frey , Christine H. Tsau
- 申请人： John R. Martin , Timothy J. Frey , Christine H. Tsau
- 申请人地址： US MA Norwood
- 专利权人： ANALOG DEVICES, INC.
- 当前专利权人： ANALOG DEVICES, INC.
- 当前专利权人地址： US MA Norwood
- 主分类号： H01L21/782
- IPC分类号： H01L21/782
摘要：
A method of forming an inertial sensor provides 1) a device wafer with a two-dimensional array of inertial sensors and 2) a second wafer, and deposits an alloy of aluminum/germanium onto one or both of the wafers. The alloy is deposited and patterned to form a plurality of closed loops. The method then aligns the device wafer and the second wafer, and then positions the alloy between the wafers. Next, the method melts the alloy, and then solidifies the alloy to form a plurality of conductive hermetic seal rings about the plurality of the inertial sensors. The seal rings bond the device wafer to the second wafer. Finally, the method dices the wafers to form a plurality of individual, hermetically sealed inertial sensors.
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