Invention Application
- Patent Title: Board on chip package
- Patent Title (中): 板上封装
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Application No.: US13067219Application Date: 2011-05-17
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Publication No.: US20110221074A1Publication Date: 2011-09-15
- Inventor: Myung-Sam Kang , Chang-Sup Ryu , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
- Applicant: Myung-Sam Kang , Chang-Sup Ryu , Jung-Hyun Park , Hoe-Ku Jung , Ji-Eun Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2006-0022844 20060310
- Main IPC: H01L23/488
- IPC: H01L23/488
Abstract:
A board on chip package including a photo solder resist having a cavity and a pattern on one side, the pattern corresponding to a circuit wire; a solder ball pad accommodated in the cavity; a circuit wire electrically connected with the solder ball pad, and formed on the other side of the photo solder resist; a semiconductor chip mounted on the solder ball pad by a flip chip bonding; and a passivation material to mold the semiconductor chip.
Information query
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