发明申请
- 专利标题： Substrate-related-operation performing apparatus and substrate-related-operation performing system
- 专利标题（中）： 基板相关操作执行装置和基板相关操作执行系统
-
申请号： US13067297申请日： 2011-05-23
-
公开(公告)号： US20110225811A1公开(公告)日： 2011-09-22
- 发明人: Seigo Kodama , Shinsuke Suhara
- 申请人： Seigo Kodama , Shinsuke Suhara
- 申请人地址： JP Chiryu-shi
- 专利权人： FUJI MACHINE MFG. CO., LTD
- 当前专利权人： FUJI MACHINE MFG. CO., LTD
- 当前专利权人地址： JP Chiryu-shi
- 优先权： JP2002-337739 20021121; JP2003-128348 20030506
- 主分类号： H05K13/04
- IPC分类号： H05K13/04
摘要：
A component mounting system and apparatus are provided that include a component mounting apparatus with a substrate holding device, a component supplying device, a head support portion, a mounting head and a forcing means. The mounting head is detachably attached to the head support portion. The mounting head of the system has a recording medium in which information relating to the mounting head is recorded. The system has an external storage portion that stores a plurality of batches of information relating to a plurality of mounting heads. The system further includes a recognizing portion that obtains and recognizes information from the external storage corresponding to the mounting head that is attached to the support portion.