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发明申请
US20110226841A1 ROOM TEMPERATURE DIRECT METAL-METAL BONDING 审中-公开
室温直接金属金属接合

ROOM TEMPERATURE DIRECT METAL-METAL BONDING
摘要：
A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116) to form a first passivation layer thereon, the first nanostructured organic coating (118) comprising an organic phase with nanoparticles dispersed within the organic phase, contacting the first nanostructured organic coating (118) with a second metallic surface (126), and applying on the first and second metallic surfaces (116, 126) at least a bonding temperature of at least room temperature and/or a bonding pressure for a bonding period to bond the first and second metallic surfaces (116, 126) thereby forming the direct metal-metal bond therebetween. A second nanostructured organic coating (128) comprising an organic phase with nanoparticles dispersed within the organic phase may also be deposited on the second metallic surface (126).
摘要（中）：

公开了在金属表面之间形成直接金属 - 金属结合的方法。 该方法包括在第一金属表面（116）上沉积第一纳米结构化有机涂层（118）以在其上形成第一钝化层，第一纳米结构有机涂层（118）包含有机相，纳米颗粒分散在有机相内， 具有第二金属表面（126）的第一纳米结构有机涂层（118），并且在第一和第二金属表面（116,126）上至少施加至少室温的粘结温度和/或粘合时间段的粘合压力 以接合第一和第二金属表面（116,126），从而在它们之间形成直接金属 - 金属粘合。 包含分散在有机相内的纳米颗粒的有机相的第二纳米结构有机涂层（128）也可沉积在第二金属表面（126）上。

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