公开(公告)号：US20110226841A1

公开(公告)日：2011-09-22

申请号：US13131818

申请日：2008-11-27

申请人： Jun Wei ,  Xiao Fang Ang ,  Chee Cheong Wong ,  Zhong Chen

发明人： Jun Wei ,  Xiao Fang Ang ,  Chee Cheong Wong ,  Zhong Chen

IPC分类号： B23K31/02 ,  B23K20/02 ,  B32B15/04 ,  B32B5/16 ,  C09D7/12 ,  B82Y99/00 ,  B82Y40/00

CPC分类号： H01L21/2007 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05644 ,  H01L2224/1181 ,  H01L2224/1182 ,  H01L2224/11821 ,  H01L2224/11822 ,  H01L2224/11823 ,  H01L2224/11826 ,  H01L2224/11827 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/13793 ,  H01L2224/13824 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/13855 ,  H01L2224/13886 ,  H01L2224/1389 ,  H01L2224/13893 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81099 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/8182 ,  H01L2225/06513 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3512 ,  H01L2924/36 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/31678 ,  H01L2924/01074 ,  H01L2924/00

摘要： A method for forming direct metal-metal bond between metallic surfaces is disclosed. The method comprises depositing a first nanostructured organic coating (118) on a first metallic surface (116) to form a first passivation layer thereon, the first nanostructured organic coating (118) comprising an organic phase with nanoparticles dispersed within the organic phase, contacting the first nanostructured organic coating (118) with a second metallic surface (126), and applying on the first and second metallic surfaces (116, 126) at least a bonding temperature of at least room temperature and/or a bonding pressure for a bonding period to bond the first and second metallic surfaces (116, 126) thereby forming the direct metal-metal bond therebetween. A second nanostructured organic coating (128) comprising an organic phase with nanoparticles dispersed within the organic phase may also be deposited on the second metallic surface (126).

摘要翻译： 公开了在金属表面之间形成直接金属 - 金属结合的方法。 该方法包括在第一金属表面（116）上沉积第一纳米结构化有机涂层（118）以在其上形成第一钝化层，第一纳米结构有机涂层（118）包含有机相，纳米颗粒分散在有机相内， 具有第二金属表面（126）的第一纳米结构有机涂层（118），并且在第一和第二金属表面（116,126）上至少施加至少室温的粘结温度和/或粘合时间段的粘合压力 以接合第一和第二金属表面（116,126），从而在它们之间形成直接金属 - 金属粘合。 包含分散在有机相内的纳米颗粒的有机相的第二纳米结构有机涂层（128）也可沉积在第二金属表面（126）上。

公开(公告)号：US20120002203A1

公开(公告)日：2012-01-05

申请号：US13255612

申请日：2010-03-08

申请人： Filippo Romanato ,  Gianluca Ruffato ,  Chee Cheong Wong ,  Lee Kwang Hong ,  Husen Kartasamita Kang

发明人： Filippo Romanato ,  Gianluca Ruffato ,  Chee Cheong Wong ,  Lee Kwang Hong ,  Husen Kartasamita Kang

IPC分类号： G01N21/55

CPC分类号： G01N21/553

摘要： A method and a system for the enhancement of the sensitivity in surface plasmon resonance (SPR) sensors based metallic grating by exploiting the conical configuration is presented. We consider the propagation of surface plasmon polaritons (SPPs) excited by light from the visible to infrared spectrum range, incident on a plasmonic grating at different directions by varying both the zenith and azimuthal angles. For specific azimuthal angles, SPPs propagate in the grating plane perpendicular to the incident light momentum. This is the condition that allows increasing the number of different excited SPPs modes largely. We exploit this effect to increase the sensor sensitivity with the change of refractive index of thin film on the plasmonic grating surface. Polarization effects also contribute to a further modes enhancement and increase the sensitivity. A scheme for a lab-on-chip implementation of a system that allows a parallel detection in microfluidic channels has been shown.

摘要翻译： 提出了一种利用锥形配置提高表面等离子体共振（SPR）传感器金属光栅灵敏度的方法和系统。 我们考虑由从可见光到红外光谱范围的光激发的表面等离子体激元（SPPs）的传播，通过改变天顶和方位角在不同方向入射到等离子体激元光栅上。 对于特定的方位角，SPP在与入射光动量垂直的光栅平面中传播。 这是允许增加不同激发的SPP模式的数量的条件。 我们利用这种效应，随着等离子体激元光栅表面上薄膜的折射率变化，增加了传感器的灵敏度。 极化效应还有助于进一步增强模式并提高灵敏度。 已经显示了允许在微流体通道中并行检测的系统的片上实验室的方案。

公开(公告)号：US09110021B2

公开(公告)日：2015-08-18

申请号：US13255612

申请日：2010-03-08

申请人： Filippo Romanato ,  Gianluca Ruffato ,  Chee Cheong Wong ,  Lee Kwang Hong ,  Husen Kartasamita Kang

发明人： Filippo Romanato ,  Gianluca Ruffato ,  Chee Cheong Wong ,  Lee Kwang Hong ,  Husen Kartasamita Kang

IPC分类号： G01N21/552

CPC分类号： G01N21/553

摘要： A method and a system for the enhancement of the sensitivity in surface plasmon resonance (SPR) sensors based metallic grating by exploiting the conical configuration is presented. We consider the propagation of surface plasmon polaritons (SPPs) excited by light from the visible to infrared spectrum range, incident on a plasmonic grating at different directions by varying both the zenith and azimuthal angles. For specific azimuthal angles, SPPs propagate in the grating plane perpendicular to the incident light momentum. This is the condition that allows increasing the number of different excited SPPs modes largely. We exploit this effect to increase the sensor sensitivity with the change of refractive index of thin film on the plasmonic grating surface. Polarization effects also contribute to a further modes enhancement and increase the sensitivity. A scheme for a lab-on-chip implementation of a system that allows a parallel detection in microfluidic channels has been shown.

摘要翻译： 提出了一种利用锥形配置提高表面等离子体共振（SPR）传感器金属光栅灵敏度的方法和系统。 我们考虑由从可见光到红外光谱范围的光激发的表面等离子体激元（SPPs）的传播，通过改变天顶和方位角在不同方向入射到等离子体激元光栅上。 对于特定的方位角，SPP在与入射光动量垂直的光栅平面中传播。 这是允许增加不同激发的SPP模式的数量的条件。 我们利用这种效应，随着等离子体激元光栅表面上薄膜的折射率变化，增加了传感器的灵敏度。 极化效应还有助于进一步增强模式并提高灵敏度。 已经显示了允许在微流体通道中并行检测的系统的片上实验室的方案。

公开(公告)号：US06121065A

公开(公告)日：2000-09-19

申请号：US160751

申请日：1998-09-25

申请人： Chee Cheong Wong ,  Shun Shen Peter Wang

发明人： Chee Cheong Wong ,  Shun Shen Peter Wang

IPC分类号： G01R31/28 ,  G01R31/26 ,  H01L21/66

CPC分类号： G01R31/2856 ,  G01R31/2831

摘要： A method of facilitating wafer level burn-in testing. The method may utilize a rerouting process to connect input and output connections of each chip on the wafer to a bus network. The bus network may be used to conduct wafer level burn-in testing and does not change the AC/DC operating characteristics of the chips.

摘要翻译： 一种便于晶片级老化测试的方法。 该方法可以利用重新路由过程将晶片上每个芯片的输入和输出连接连接到总线网络。 总线网络可用于进行晶片级老化测试，并且不改变芯片的AC / DC工作特性。