发明申请
- 专利标题： Wafer Level Packaging Bond
- 专利标题（中）： 晶圆级包装标签
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申请号： US12729911申请日： 2010-03-23
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公开(公告)号： US20110233621A1公开(公告)日： 2011-09-29
- 发明人: Martin Liu , Richard Chu , Hung-Hua Lin , H. T. Huang , Jung-Huei Peng , Yuan-Chih Hsieh , Lan-Lin Chao , Chun-Wen Cheng , Chia-Shiung Tsai
- 申请人： Martin Liu , Richard Chu , Hung-Hua Lin , H. T. Huang , Jung-Huei Peng , Yuan-Chih Hsieh , Lan-Lin Chao , Chun-Wen Cheng , Chia-Shiung Tsai
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L27/04
- IPC分类号： H01L27/04 ; H01L21/77 ; H01L29/84
摘要：
The present disclosure provides a method of bonding a plurality of substrates. In an embodiment, a first substrate includes a first bonding layer. The second substrate includes a second bonding layer. The first bonding layer includes silicon; the second bonding layer includes aluminum. The first substrate and the second substrate are bonded forming a bond region having an interface between the first bonding layer and the second bonding layer. A device having a bonding region between substrates is also provided. The bonding region includes an interface between a layer including silicon and a layer including aluminum.
公开/授权文献
- US08647962B2 Wafer level packaging bond 公开/授权日：2014-02-11
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