An object is to provide an inverter module that can ensure satisfactory anti-vibration strength, moisture resistance, and isolation for each of the upper and lower boards of the inverter module and that can reduce the weight and cost, and to provide an integrated-inverter electric compressor. In an inverter module (21) in which a power system board (23) and a control board (31) are integrated via a resin case (22), the inverter module (21) is configured such that the power system board (23), on which a semiconductor switching device (24) is mounted, is provided at the lower part of the resin case (22) and the control board (31), on which a control-and-communication circuit is mounted, is provided thereabove. In the resin case (22), a thermosetting resin (36) is filled to a height position where the top surface of the power system board is covered (23), so that the power system board (23) is encapsulated in the resin, and a gel-like resin material (38) is filled from a resin-encapsulated surface (37) to a height position where a part of the control board (31) is covered.