发明申请
- 专利标题： STRIPPING DEVICE AND STRIPPING METHOD
- 专利标题（中）： 剥离装置和剥离方法
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申请号： US13093412申请日： 2011-04-25
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公开(公告)号： US20110259527A1公开(公告)日： 2011-10-27
- 发明人: Kimihiro Nakada , Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao , Satoshi Kobari
- 申请人： Kimihiro Nakada , Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao , Satoshi Kobari
- 申请人地址： JP Kawasaki-shi
- 专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人： TOKYO OHKA KOGYO CO., LTD.
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2010-102066 20100427; JP2010-102081 20100427
- 主分类号： B32B38/10
- IPC分类号： B32B38/10
摘要：
A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
公开/授权文献
- US08302651B2 Stripping device and stripping method 公开/授权日：2012-11-06
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