Invention Application
- Patent Title: LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER
- Patent Title (中): 使用液晶聚合物的发光二极管封装
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Application No.: US13122323Application Date: 2009-10-01
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Publication No.: US20110260192A1Publication Date: 2011-10-27
- Inventor: Chang Hoon Kwak , II Woo Park , Jong Rak Sohn , Hyo Jin Lee , Na Na Park , Seong Ah Joo
- Applicant: Chang Hoon Kwak , II Woo Park , Jong Rak Sohn , Hyo Jin Lee , Na Na Park , Seong Ah Joo
- Priority: KR10-2008-0096763 20081001
- International Application: PCT/KR09/05671 WO 20091001
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/38
Abstract:
A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.
Information query
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