公开(公告)号：US20110260192A1

公开(公告)日：2011-10-27

申请号：US13122323

申请日：2009-10-01

申请人： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

发明人： Chang Hoon Kwak ,  II Woo Park ,  Jong Rak Sohn ,  Hyo Jin Lee ,  Na Na Park ,  Seong Ah Joo

IPC分类号： H01L33/60 ,  H01L33/38

CPC分类号： H01L33/56 ,  H01L24/48 ,  H01L33/02 ,  H01L33/382 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01084 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light emitting diode (LED) package using a liquid crystal polymer, includes: a package main body formed by using a liquid crystal polymer; a lead frame formed on the package main body; an LED chip mounted on the lead frame; and a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors. The LED package is highly reliable.

摘要翻译： 使用液晶聚合物的发光二极管（LED）封装包括：通过使用液晶聚合物形成的封装主体; 形成在所述包装主体上的引线框架; 安装在引线框架上的LED芯片; 以及封装LED芯片的树脂封装单元，所述树脂封装单元包括荧光体。 LED封装非常可靠。

公开(公告)号：US20100127290A1

公开(公告)日：2010-05-27

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  II Woo Park

IPC分类号： H01L21/50 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US20140141283A1

公开(公告)日：2014-05-22

申请号：US14127878

申请日：2011-08-12

申请人： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

发明人： Seung Jae Lee ,  Na Na Park ,  Gyeong Seon Seon Park ,  Bo Kyoung Kim ,  Jong Rak Sohn ,  Chang Hoon Kwak

IPC分类号： C09K11/02 ,  B05D5/06

CPC分类号： C09K11/025 ,  B05D5/06 ,  C08J7/06 ,  C09K11/08

摘要： A method of manufacturing a phosphor resin film and a phosphor resin film manufactured thereby are provided. The method of manufacturing a phosphor resin film includes preparing a polymer slurry by mixing a polymer resin and a latent curing agent in a solvent, spreading the polymer slurry such that it has a film shape, drying the spread polymer slurry to form a semi-hardened resin film, and providing phosphor powder to the semi-hardened resin film. A phosphor resin film includes semi-hardened resin film including a polymer resin and a latent curing agent and phosphors uniformly formed on one surface of the semi-hardened resin film.

摘要翻译： 提供了制造荧光体树脂膜的方法和由此制造的荧光体树脂膜。 制造荧光体树脂膜的方法包括通过在溶剂中混合聚合物树脂和潜在性固化剂来制备聚合物浆料，将聚合物浆料铺展成膜形状，干燥扩展聚合物浆料以形成半硬化 树脂膜，并向半硬化树脂膜提供荧光体粉末。 荧光体树脂膜包括半固化树脂膜，其包含聚合物树脂和潜在性固化剂以及均匀地形成在半硬化树脂膜的一个表面上的荧光体。

公开(公告)号：US08445927B2

公开(公告)日：2013-05-21

申请号：US12360250

申请日：2009-01-27

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L21/50

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

公开(公告)号：US08507299B2

公开(公告)日：2013-08-13

申请号：US12785024

申请日：2010-05-21

申请人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

发明人： Seong Ah Joo ,  Chang Hoon Kwak ,  Na Na Park ,  Il Woo Park

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L33/486 ,  H01L33/56 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The present invention relates to a light emitting diode package and a manufacturing method thereof.The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.

摘要翻译： 本发明涉及发光二极管封装及其制造方法。 发光二极管封装包括基板，安装在基板的上部的LED芯片，涂覆在基板上部的模塑材料，其包括LED芯片的外表面，以及涂覆在基板的下部的密封剂 并且可以提高发光效率，最小化封装故障，并且通过促进制造工艺来降低制造成本。

公开(公告)号：US20110266584A1

公开(公告)日：2011-11-03

申请号：US13183176

申请日：2011-07-14

申请人： Jong Rak SOHN ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

发明人： Jong Rak SOHN ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

IPC分类号： H01L33/50

CPC分类号： C09K11/7792 ,  C09K11/0883 ,  C09K11/7786 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00014

摘要： Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

摘要翻译： 提供了包括蓝色LED芯片的白色发光二极管（LED） 以及以预定混合比涂覆在蓝色LED芯片上的黄色，绿色和红色发光荧光体，并将从蓝色LED芯片发出的光转换成白色光。

公开(公告)号：US07804239B2

公开(公告)日：2010-09-28

申请号：US12155691

申请日：2008-06-09

申请人： Jong Rak Sohn ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

发明人： Jong Rak Sohn ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

IPC分类号： H01J1/62

CPC分类号： C09K11/0883 ,  C09K11/7786 ,  C09K11/7792 ,  H05B33/14 ,  Y02B20/181

摘要： Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

摘要翻译： 提供了包括蓝色LED芯片的白色发光二极管（LED） 以及以预定混合比涂覆在蓝色LED芯片上的黄色，绿色和红色发光荧光体，并将从蓝色LED芯片发出的光转换成白色光。

公开(公告)号：US20080180948A1

公开(公告)日：2008-07-31

申请号：US12003814

申请日：2008-01-02

申请人： Chul Soo Yoon ,  Il Woo Park ,  Jong Rak Sohn ,  Chang Hoon Kwak

发明人： Chul Soo Yoon ,  Il Woo Park ,  Jong Rak Sohn ,  Chang Hoon Kwak

IPC分类号： H01L33/00

CPC分类号： H01L33/504 ,  C09K11/0883 ,  C09K11/7728 ,  C09K11/7731 ,  C09K11/7734 ,  H05B33/14 ,  Y02B20/181

摘要： A white light emitting device including: a blue LE chip having a dominant wavelength of 430 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue LED chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram, and the red phosphor includes a phosphor represented by (Sr, Ba, Ca)AlSiN3:Eu and the green phosphor includes a phosphor represented by (Sr, Ba, Ca)2SiO4:Eu.

摘要翻译： 一种白色发光器件，包括：主要波长为430至455nm的蓝色LE芯片; 配置在蓝色发光二极管芯片周围的红色荧光体，由蓝色发光二极管芯片激发的红色荧光体发射红色光; 以及配置在蓝色发光二极管芯片周围的绿色荧光体，由蓝色LED芯片激发的绿色荧光体发出绿色光，其中，从红色荧光体发出的红色光线具有落在由四个坐标点 0.5448,0.4544），（0.7079,0.22920），（0.6427,0.2905）和（0.4794,0.44633），从绿色荧光体发出的绿光具有落在由四个坐标定义的空间内的色坐标 基于CIE1931色度图，点（0.1270,0.8037），（0.4117,0.5861），（0.4197,0.5316）和（0.2555,0.5030），红色荧光体包括由（Sr，Ba，Ca）AlSiN Eu，绿色荧光体包括由（Sr，Ba，Ca）2 SiO 4：Eu表示的荧光体。

公开(公告)号：US08378568B2

公开(公告)日：2013-02-19

申请号：US13183176

申请日：2011-07-14

申请人： Jong Rak Sohn ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

发明人： Jong Rak Sohn ,  Chul Soo Yoon ,  Chang Hoon Kwak ,  Il Woo Park

IPC分类号： H01L33/50

CPC分类号： C09K11/7792 ,  C09K11/0883 ,  C09K11/7786 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00014

摘要： Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

摘要翻译： 提供了包括蓝色LED芯片的白色发光二极管（LED） 以及以预定混合比涂覆在蓝色LED芯片上的黄色，绿色和红色发光荧光体，并将从蓝色LED芯片发出的光转换成白色光。

公开(公告)号：US07911127B2

公开(公告)日：2011-03-22

申请号：US11320137

申请日：2005-12-28

申请人： Jong Rak Sohn ,  Il Woo Park ,  Yun Seup Chung ,  Chang Hoon Kwak ,  Chul Soo Yoon ,  Joon Ho Yoon

发明人： Jong Rak Sohn ,  Il Woo Park ,  Yun Seup Chung ,  Chang Hoon Kwak ,  Chul Soo Yoon ,  Joon Ho Yoon

IPC分类号： H01J1/62

CPC分类号： C09K11/7739 ,  C09K11/7731 ,  C09K11/7734 ,  H01L33/502 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  Y02B20/181 ,  H01L2924/00014

摘要： The present invention relates to phosphor blend for wavelength conversion and a white light emitting device using the same. The phosphor blend of the invention comprises three phosphors, A5(PO4)3Cl:Eu2+, D2SiO4:Eu and MS:Eu at a composition where near ultraviolet radiation is converted into light positioned at a CIE coordinate (x, y), where 0.25≦x≦0.45 and 0.25≦y≦0.43, wherein A comprises at least one of Sr, Ca, Ba, and Mg, D comprises at least one of Ba, Sr, and Ca, and M comprises at least one of Sr and Ca. Furthermore, the present invention provides a new white light emitting device in combination of the phosphor blend and a near ultraviolet LED.

摘要翻译： 本发明涉及用于波长转换的荧光粉混合物和使用其的白色发光装置。 本发明的荧光体共混物包括三种荧光体，其中近紫外辐射被转换成位于CIE坐标（x，y）的光，其中0.25和nlE（x，y）的化合物为A5（PO4）3Cl:Eu2 +，D2SiO4：Eu和MS： 其中A包含Sr，Ca，Ba和Mg中的至少一种，D包括Ba，Sr和Ca中的至少一种，M包括Sr和Ca中的至少一种，Sr和Ca， 可以 此外，本发明提供了一种新的白光发光装置，其结合了荧光体共混物和近紫外LED。