发明申请
- 专利标题： Method of exposing a semiconductor wafer and exposure apparatus
- 专利标题（中）： 曝光半导体晶片和曝光装置的方法
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申请号： US13067139申请日： 2011-05-11
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公开(公告)号： US20110279798A1公开(公告)日： 2011-11-17
- 发明人: Masayoshi Danbata , Hisanori Ueno
- 申请人： Masayoshi Danbata , Hisanori Ueno
- 申请人地址： JP Tokyo
- 专利权人： Elpida Memory, Inc.
- 当前专利权人： Elpida Memory, Inc.
- 当前专利权人地址： JP Tokyo
- 优先权： JPP2010-111170 20100513
- 主分类号： G03B27/34
- IPC分类号： G03B27/34
摘要：
An exposure method includes the following processes. An autofocus scan process is performed to detect a defocused portion of a first resist film over a semiconductor wafer and to generate a detection signal that indicates the defocused portion detected. A first exposure scan process is performed while selectively blinding the first resist film, with reference to a detection signal related to the defocused portion detected.
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