发明申请
- 专利标题: METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE
- 专利标题(中): 制造散热半导体封装结构的方法
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申请号: US13195639申请日: 2011-08-01
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公开(公告)号: US20110287588A1公开(公告)日: 2011-11-24
- 发明人: Wen-Tsung Tseng , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
- 申请人: Wen-Tsung Tseng , Ho-Yi Tsai , Chien-Ping Huang , Cheng-Hsu Hsiao
- 申请人地址: TW Taichung
- 专利权人: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址: TW Taichung
- 优先权: TW096114195 20070423
- 主分类号: H01L21/56
- IPC分类号: H01L21/56
摘要:
A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.