发明申请
- 专利标题： Methods and Apparatus for Cleaning Semiconductor Wafers
- 专利标题（中）： 用于清洁半导体晶片的方法和装置
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申请号： US13133826申请日： 2008-12-12
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公开(公告)号： US20110290277A1公开(公告)日： 2011-12-01
- 发明人: Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Hui Wang
- 申请人： Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Hui Wang
- 国际申请： PCT/CN2008/073471 WO 20081212
- 主分类号： B08B3/12
- IPC分类号： B08B3/12
摘要：
A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5λ/N for each rotation of the chuck, where λ is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5λn during the cleaning process, where λ is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.
公开/授权文献
- US09595457B2 Methods and apparatus for cleaning semiconductor wafers 公开/授权日：2017-03-14
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