发明申请
- 专利标题： LIGHT-EMITTING-DEVICE PACKAGE AND A METHOD FOR PRODUCING THE SAME
- 专利标题（中）： 发光器件封装及其制造方法
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申请号： US13142950申请日： 2009-12-30
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公开(公告)号： US20110291143A1公开(公告)日： 2011-12-01
- 发明人: Jin Ha Kim , Masami Nei , Seok Min Hwang , Chung Bae Jeon
- 申请人： Jin Ha Kim , Masami Nei , Seok Min Hwang , Chung Bae Jeon
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG LED CO., LTD.
- 当前专利权人： SAMSUNG LED CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2008-0136954 20081230; KR10-2009-0132239 20091228
- 国际申请： PCT/KR09/07936 WO 20091230
- 主分类号： H01L33/60
- IPC分类号： H01L33/60
摘要：
A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part.
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