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    High-Power LED Chip Packaging Structure And Fabrication Method Thereof
    3.
    发明申请
    High-Power LED Chip Packaging Structure And Fabrication Method Thereof 审中-公开
    大功率LED芯片封装结构及其制作方法

    公开(公告)号：US20070243645A1

    公开(公告)日：2007-10-18

    申请号：US11765541

    申请日：2007-06-20

    申请人： Cheng Lin ,  Hua-Hsin Su ,  Masami Nei

    发明人： Cheng Lin ,  Hua-Hsin Su ,  Masami Nei

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which is exposed from the top surface of the base, and from the bottom surface or a side surface of the base. The metallic material also forms a plurality of electrodes surrounding the heat sinking seat, which are exposed from the top surface of the base, and from the bottom surface or a side surface of the base, respectively. The electrically insulating material is interposed between the electrodes and the heat sinking seat so that they are adhere together, and so that the heat sinking seat and any one of the electrodes, and any two electrodes are electrically insulated. The packaging structure achieves superior heat dissipation efficiency by separating the electricity and heat dissipation channels and, in another way, is applicable in mass production for a significantly reduced production cost.

    摘要翻译： 本发明提供了一种用于大功率LED芯片的封装结构和相关制造方法，其主要包括由金属材料制成的基底和集成到单个物体中的电绝缘材料。 金属材料在基部的中部形成散热座，该座从基座的顶表面露出并且从基座的底表面或侧表面露出。 金属材料还形成围绕从基座的顶表面暴露的散热座和从基座的底表面或侧表面的多个电极。 电绝缘材料插入在电极和散热座之间，使得它们粘附在一起，使得散热座和任何一个电极以及任何两个电极被电绝缘。 封装结构通过分离电力和散热通道实现了优异的散热效率，另一种方式适用于批量生产，大大降低了生产成本。

    Semiconductor light emitter and flat panel display lighting system
    4.
    发明授权
    Semiconductor light emitter and flat panel display lighting system 有权
    半导体发光器和平板显示器照明系统

    公开(公告)号：US06597018B2

    公开(公告)日：2003-07-22

    申请号：US09959940

    申请日：2001-11-13

    申请人： Masami Nei

    发明人： Masami Nei

    IPC分类号： H01L2715

    CPC分类号： H01L33/483 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A flat panel display lighting system 20 includes: semiconductor light-emitting device 10; board 21; and light guide plate 22. The device 10 includes an inverted T-shaped substrate 1 having a base portion 1a, on which a pair of electrodes 2 and 3 are formed, and a mounting portion 1b, on which a light emitter 4 is mounted. The device 10 is mounted through the board 21 with the mounting portion 1b set through an opening 21a formed in the board 21. A light guide plate 22 is mounted on the board 21 so that a face of the plate 22 faces the light emitter 4. Each of the pair of electrodes 2 and 3 is formed on the substrate 1 of the device 10 so as to be electrically connected to the light emitter 4 and to a circuit pattern formed on the board 21.

    摘要翻译： 平板显示照明系统20包括：半导体发光装置10; 板21; 和导光板22.装置10包括倒置的T形基板1，其具有形成有一对电极2和3的基部1a和安装有发光体4的安装部分1b。 装置10通过板21安装，安装部分1b通过形成在板21中的开口21a设置。导光板22安装在板21上，使得板22的表面面向发光器4。 一对电极2和3中的每一个形成在器件10的基板1上，以便电连接到光发射器4和形成在电路板21上的电路图案。

    LIGHT EMITTING DIODE PACKAGE ARRAY AND METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE
    5.
    发明申请
    LIGHT EMITTING DIODE PACKAGE ARRAY AND METHOD FOR FABRICATING LIGHT EMITTING DIODE PACKAGE 有权
    发光二极管封装阵列和制造发光二极管封装的方法

    公开(公告)号：US20130049033A1

    公开(公告)日：2013-02-28

    申请号：US13597789

    申请日：2012-08-29

    申请人： Masami Nei

    发明人： Masami Nei

    IPC分类号： H01L33/48 ,  H01L33/50

    CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs.

    摘要翻译： 发光二极管（LED）封装包括：阵列基板; 安装在阵列基板上并以行和列布置的多个LED; 多个波长转换单元，其设置在从所述多个LED中的每一个发射的光的光路中以转换其波长; 多个第一检查端子，形成在所述阵列基板上，并且与所述多个LED中的相同行中的LED电连接; 以及多个第二检查端子，形成在所述阵列基板上，并且与所述多个LED中的同一列中的LED电连接。

    High-power LED chip packaging structure and fabrication method thereof
    6.
    发明申请
    High-power LED chip packaging structure and fabrication method thereof 审中-公开
    大功率LED芯片封装结构及其制造方法

    公开(公告)号：US20070126020A1

    公开(公告)日：2007-06-07

    申请号：US11294135

    申请日：2005-12-03

    申请人： Cheng Lin ,  Hua-Hsin Su ,  Masami Nei

    发明人： Cheng Lin ,  Hua-Hsin Su ,  Masami Nei

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A packaging structure and a related fabrication method for high-power LED chip are provided herein, which mainly contains a base made of a metallic material and an electrically insulating material integrated into a single object. The metallic material forms a heat sinking seat in the middle of the base, which is exposed from the top surface of the base, and from the bottom surface or a side surface of the base. The metallic material also forms a plurality of electrodes surrounding the heat sinking seat, which are exposed from the top surface of the base, and from the bottom surface or a side surface of the base, respectively. The electrically insulating material is interposed between the electrodes and the heat sinking seat so that they are adhere together, and so that the heat sinking seat and any one of the electrodes, and any two electrodes are electrically insulated. The packaging structure achieves superior heat dissipation efficiency by separating the electricity and heat dissipation channels and, in another way, is applicable in mass production for a significantly reduced production cost.

    摘要翻译： 本发明提供了一种用于大功率LED芯片的封装结构和相关制造方法，其主要包括由金属材料制成的基底和集成到单个物体中的电绝缘材料。 金属材料在基部的中部形成散热座，该座从基座的顶表面露出并且从基座的底表面或侧表面露出。 金属材料还形成围绕从基座的顶表面暴露的散热座和从基座的底表面或侧表面的多个电极。 电绝缘材料插入在电极和散热座之间，使得它们粘附在一起，使得散热座和任何一个电极以及任何两个电极被电绝缘。 封装结构通过分离电力和散热通道实现了优异的散热效率，另一种方式适用于批量生产，大大降低了生产成本。

    Light emitting diode package array and method for fabricating light emitting diode package
    7.
    发明授权
    Light emitting diode package array and method for fabricating light emitting diode package 有权
    发光二极管封装阵列及制造发光二极管封装的方法

    公开(公告)号：US08643032B2

    公开(公告)日：2014-02-04

    申请号：US13597789

    申请日：2012-08-29

    申请人： Masami Nei

    发明人： Masami Nei

    IPC分类号： H01L33/48 ,  H01L33/50

    CPC分类号： H01L33/642 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode (LED) package includes: an array substrate; a plurality of LEDs mounted on the array substrate and arranged in rows and columns; a plurality of wavelength conversion units disposed in a light path of light emitted from each of the plurality of LEDs to convert the wavelength thereof; a plurality of first inspection terminals formed on the array substrate and electrically connected to LEDs in the same rows, among the plurality of LEDs; and a plurality of second inspection terminals formed on the array substrate and electrically connected to LEDs in the same columns, among the plurality of LEDs.

    摘要翻译： 发光二极管（LED）封装包括：阵列基板; 安装在阵列基板上并以行和列布置的多个LED; 多个波长转换单元，其设置在从所述多个LED中的每一个发射的光的光路中以转换其波长; 多个第一检查端子，形成在所述阵列基板上，并且与所述多个LED中的相同行中的LED电连接; 以及多个第二检查端子，形成在所述阵列基板上，并且与所述多个LED中的同一列中的LED电连接。

    Dual port semiconductor memory having random and serial access modes
    8.
    发明授权
    Dual port semiconductor memory having random and serial access modes 失效
    具有随机和串行访问模式的双端口半导体存储器

    公开(公告)号：US4858190A

    公开(公告)日：1989-08-15

    申请号：US5104

    申请日：1987-01-20

    申请人： Yasunori Yamaguchi ,  Akirahiko Yoshida ,  Masami Nei ,  Masamichi Ishihara ,  Yukio Yamamoto

    发明人： Yasunori Yamaguchi ,  Akirahiko Yoshida ,  Masami Nei ,  Masamichi Ishihara ,  Yukio Yamamoto

    IPC分类号： G11C7/00 ,  G11C7/10 ,  G11C8/00 ,  G11C8/04 ,  G11C8/16 ,  G11C11/401

    CPC分类号： G11C7/1075 ,  G11C8/16

    摘要： A semiconductor memory is provided in which a column decoder is used commonly for the random input and output and the serial input/output by providing both a signal path for transmitting signals in parallel to the data lines of a memory array and a latch circuit and a switch path for connecting said latch circuit and a serial input/output common data line in response to a selection signal generated by a shift register, and by feeding the output signal of a random input/output column decoder as an initial value to the individual bits of said shift register.

    摘要翻译： 提供一种半导体存储器，其中列解码器通常用于随机输入和输出以及串行输入/输出，通过提供用于与存储器阵列和锁存电路的数据线并行发送信号的信号路径和 用于响应于由移位寄存器产生的选择信号连接所述锁存电路和串行输入/输出公共数据线的开关路径，并且通过将随机输入/输出列解码器的输出信号作为初始值馈送到各个位 的移位寄存器。