Invention Application
US20110291256A1 Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
审中-公开
制造半导体芯片封装和半导体芯片封装的方法
- Patent Title: Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
- Patent Title (中): 制造半导体芯片封装和半导体芯片封装的方法
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Application No.: US12791443Application Date: 2010-06-01
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Publication No.: US20110291256A1Publication Date: 2011-12-01
- Inventor: Rainer Steiner , Jens Pohl , Werner Robl , Gottfried Beer
- Applicant: Rainer Steiner , Jens Pohl , Werner Robl , Gottfried Beer
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/50
Abstract:
A semiconductor chip includes a contact pad on a main surface of the chip. An electrically conductive layer is applied onto the contact pad. The main surface of the semiconductor chip is covered with an insulating layer. An electrically conductive contact area is formed within the insulating layer such that the contact area and the insulating layer include coplanar exposed surfaces and the contact area is electrically connected with the electrically conductive layer and includes an extension which is greater than the extension of the electrically conductive layer along a direction parallel to the main surface of the semiconductor chip.
Information query
IPC分类:
