发明申请
- 专利标题： PASSIVATION LAYER EXTENSION TO CHIP EDGE
- 专利标题（中）： 钝化层延伸到芯片边缘
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申请号： US12796068申请日： 2010-06-08
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公开(公告)号： US20110298095A1公开(公告)日： 2011-12-08
- 发明人: Timothy H. Daubenspeck , Ekta Misra , Marie-Claude Paquet , Francis Santerre , Wolfgang Sauter
- 申请人： Timothy H. Daubenspeck , Ekta Misra , Marie-Claude Paquet , Francis Santerre , Wolfgang Sauter
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L23/00
摘要：
Embodiments of the invention provide a semiconductor chip having a passivation layer extending along a surface of a semiconductor substrate to an edge of the semiconductor substrate, and methods for their formation. One aspect of the invention provides a semiconductor chip comprising: a semiconductor substrate; a passivation layer including a photosensitive polyimide disposed along a surface of the semiconductor substrate and extending to at least one edge of the semiconductor substrate; and a channel extending through the passivation layer to the surface of the semiconductor substrate.
公开/授权文献
- US08299581B2 Passivation layer extension to chip edge 公开/授权日：2012-10-30
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